Abstract: A microelectromechanical systems (MEMS) device comprising: a substrate; a signal conductor supported on the substrate; ground conductors supported on the substrate on either side of the signal conductor; and a MEMS bridge at least one end of which is mechanically connected to the substrate by way of at least one anchor, the MEMS bridge comprising an electrically conductive switching portion, the electrically conductive switching portion comprising a switching signal conductor region and a switching ground conductor region, the switching signal conductor region being provided over the signal conductor and the switching ground conductor region being provided over a said ground conductor, the electrically conductive switching region being movable relative to the said signal and ground conductors respectively to thereby change the inductances between the switching signal conductor region and the signal conductor and between the switching ground conductor region and the respective ground conductor, wherein there i

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.

Abstract: The invention relates to antenna apparatus comprising: an antenna, a signal conductor and one or more RF MEMS switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a crystalline MEMS substrate; and a capping substrate comprising a capping portion, wherein an enclosed volume is formed around the said MEMS switches between the capping portion and at least a portion of the crystalline MEMS substrate, and wherein the capping substrate comprises the said antenna.

Abstract: The invention relates to antenna apparatus comprising: an antenna, a signal conductor and one or more RF MEMS switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a crystalline MEMS substrate; and a capping substrate comprising a capping portion, wherein an enclosed volume is formed around the said MEMS switches between the capping portion and at least a portion of the crystalline MEMS substrate, and wherein the capping substrate comprises the said antenna.

Abstract: The invention provides an antenna array comprising: a plurality of antenna modules, each of the antenna modules comprising an antenna, a signal conductor and one or more microelectromechanical (MEMS) switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a MEMS substrate; and one or more integrated circuits comprising MEMS control circuitry configured to control the said one or more MEMS switches and/or signal processing circuitry configured to process signals received and/or to be transmitted by the antennas of the antenna modules, wherein the antenna modules and integrated circuits are supported by a common carrier substrate comprising the antennas of the antenna modules, the MEMS switches; or the said one or more integrated circuits. A hierarchy of MEMS controllers includes a master MEMS controller and local MEMS controllers which send control signals to a plurality of MEMS switches.

Abstract: A microelectromechanical systems (MEMS) device comprising: a substrate; a signal conductor supported on the substrate; ground conductors supported on the substrate on either side of the signal conductor; and a MEMS bridge at least one end of which is mechanically connected to the substrate by way of at least one anchor, the MEMS bridge comprising an electrically conductive switching portion, the electrically conductive switching portion comprising a switching signal conductor region and a switching ground conductor region, the switching signal conductor region being provided over the signal conductor and the switching ground conductor region being provided over a said ground conductor, the electrically conductive switching region being movable relative to the said signal and ground conductors respectively to thereby change the inductances between the switching signal conductor region and the signal conductor and between the switching ground conductor region and the respective ground conductor, wherein there i

Abstract: The invention relates to antenna apparatus comprising: an antenna, a signal conductor and one or more RF MEMS switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a crystalline MEMS substrate; and a capping substrate comprising a capping portion, wherein an enclosed volume is formed around the said MEMS switches between the capping portion and at least a portion of the crystalline MEMS substrate, and wherein the capping substrate comprises the said antenna.

Abstract: The invention provides an antenna array comprising: a plurality of antenna modules, each of the antenna modules comprising an antenna, a signal conductor and one or more microelectromechanical (MEMS) switches, the antenna being conductively connected to the signal conductor, the MEMS switches and at least a portion of the signal conductor being supported by a MEMS substrate; and one or more integrated circuits comprising MEMS control circuitry configured to control the said one or more MEMS switches and/or signal processing circuitry configured to process signals received and/or to be transmitted by the antennas of the antenna modules, wherein the antenna modules and integrated circuits are supported by a common carrier substrate comprising the antennas of the antenna modules, the MEMS switches; or the said one or more integrated circuits. A hierarchy of MEMS controllers includes a master MEMS controller and local MEMS controllers which send control signals to a plurality of MEMS switches.

Abstract: An adaptive manufacturing process for a Film Bulk Acoustic Resonator (FBAR) tests the FBAR circuit during manufacturing to determine a resonant frequency thereof. Reactive tuning elements may be adjusted as needed depending on the testing to change the resonant frequency to a desired resonant frequency. In an exemplary embodiment, predetermined masks may be applied to modify the tuning elements.

Abstract: The present invention embeds passive components within a multilayer substrate used for mounting integrated circuits and other electronic components to form an electronic module or circuit board. During construction of the multilayer substrate, passive components are attached to an inside surface of a metallic foil layer. The inside surface of the metallic foil layer is then laminated to another metallic foil layer, such that the foil layers are parallel to but separated from each other. As such, the passive component is embedded within the multilayer substrate. Contacts are formed for the passive component by etching away portions of the foil layer on which the passive component resides. Electrical connections can be routed in the foil to effectively couple the passive component to a circuit formed on the multilayer substrate as desired. The embedded passive components can take various forms, such as capacitors, inductors, and resistors.

Abstract: An adaptive manufacturing process for a Film Bulk Acoustic Resonator (FBAR) tests the FBAR circuit during manufacturing to determine a resonant frequency thereof. Reactive tuning elements may be adjusted as needed depending on the testing to change the resonant frequency to a desired resonant frequency. In an exemplary embodiment, predetermined masks may be applied to modify the tuning elements.

Abstract: A patch antenna may be integrated into a mobile terminal by associating the patch antenna with a ground plane adapted to remove eddy currents and isolate the antenna from spurious electromagnetic signals. The patch antenna may comprise a kink. Together the patch antenna and ground plane form a surface on which other electrical components may be mounted, such as the transceiver circuitry of the mobile terminal.

Abstract: A telescoping frame cross bar is connected at its opposite ends to respective horizontally spaced vertical doorway riser tubes to form a vertical support frame assembly. Straps having their lower ends fixed to a trapeze bar at laterally spaced positions further have hooks at their upper ends to suspend the trapeze bar from the frame cross bar.