Abstract: A method and system for rendering a desktop on a computer using a composited desktop model operating system are disclosed. A composited desktop window manager, upon receiving content information from application programs, draws the window to a buffer memory for future reference, and takes advantage of advanced graphics hardware and visual effects to render windows based on content on which they are drawn. The windows may also be rendered based on environment variables including virtual light sources. The frame portion of each window may be generated by pixel shading a bitmap having the appearance of frosted glass based on the content of the desktop on top of which the frame is displayed. Legacy support is provided so that the operating system can draw and render windows generated by legacy applications to look consistent with non-legacy application windows.

Abstract: A method and system for rendering a desktop on a computer using a composited desktop model operating system are disclosed. A composited desktop window manager, upon receiving content information from application programs, draws the window to a buffer memory for future reference, and takes advantage of advanced graphics hardware and visual effects to render windows based on content on which they are drawn. The windows may also be rendered based on environment variables including virtual light sources. The frame portion of each window may be generated by pixel shading a bitmap having the appearance of frosted glass based on the content of the desktop on top of which the frame is displayed. Legacy support is provided so that the operating system can draw and render windows generated by legacy applications to look consistent with non-legacy application windows.

Abstract: A method and system for rendering a desktop on a computer using a composited desktop model operating system are provided. A composited desktop window manager, upon receiving base object and content object information for one or more content objects from an application program, draws the window to a buffer memory, and takes advantage of advanced graphics hardware and visual effects to render windows based on content on which they are drawn. The frame portion of each window may be generated by pixel shading a bitmap having the appearance of frosted glass based on the content of the desktop on top of which the frame is displayed. Legacy support is provided so that the operating system can draw and render windows generated by legacy applications to look consistent with non-legacy application windows.

Abstract: Methods and apparatuses are provided for controlling application software while switching between session in a multi-session computing environment. An apparatus includes memory coupled to switching logic and application program managing logic. The switching logic is configured to selectively switch console control of a computing device between at least two user kernel sessions that are maintained in the memory. The application program managing logic is configured to selectively control at least one application program that is operatively configured within at least one of the user kernel sessions. For example, the application program managing logic can be configured to stop the operation, restart certain application programs, notify application programs about switching events, and/or adjust the playback of audio and/or video signals associated certain application programs.

Abstract: Methods for packaging microelectronic devices and microelectronic devices formed by such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of microelectronic dies to a support member, covering the dies and at least a portion of the support member with a dielectric layer, forming a plurality of vias through the dielectric layer between the dies, and fabricating a plurality of conductive links in corresponding vias. In another embodiment, a plurality of microelectronic devices includes a support member, a plurality of microelectronic dies coupled to the support member, a dielectric layer over the dies and at least a portion of the support member, and a plurality of conductive links extending from a first surface of the dielectric layer to a second surface. The dies include an integrated circuit and a plurality of bond-pads coupled to the integrated circuit, and the conductive links are disposed between the dies.

Abstract: Various mechanisms are disclosed for protecting the security of memory in a computing environment. A security layer can have an encryption layer and a hashing layer that can dynamically encrypt and then dynamically hash sensitive information, as it is being loaded to dynamic memory of a computing device. For example, a memory unit that can correspond to a memory page can be processed by the security layer, and header data, code, and protect-worthy data can be secured, while other non-sensitive data can be left alone. Once such information is secured and stored in dynamic memory, it can be accessed at a later time by a processor and unencrypted and hash checked. Then, it can be loaded back onto the dynamic memory, thereby preventing direct memory access attacks.

Abstract: Techniques for migrating content from a first set of conditions to a second set of conditions are disclosed herein. In particular, a content migration certificate is utilized to enable content migration and set forth under what conditions content may be accessed after migration. The content migration certificate may, for example, be stored as a file in a removable storage unit or transferred online once an indication that conditions have changed is received. The change in conditions may involve a new device attempting to access the content file, a new user attempting to access the content, or any other similar conditions. Access to the information in the content migration certificate may be protected by encryption so that only devices and/or users meeting the conditions of the certificate are permitted to transfer content. By accessing the content migration certificate in the prescribed manner, migration of content is enabled in a controlled and easy process.

Abstract: An individualized per device initialization of a computing device is unique relative to the initialization of other computing devices. A common initialization program, common to all computing devices of a particular type such as a game console, may be modified to be unique for each computing device. Modification may comprise the application of at least one individualized per device secret, e.g., key, to at least a portion of the common initialization program such as at least one initialization stage. Initialization is tied to one or more device specific identities. In this way, initialization vulnerabilities discovered on a particular device cannot be exploited en masse on other computing devices because each initialization program stored in each computing device is unique. The device specific nature of the initialization program may be extended to other information input to the computing device in order to prevent unauthorized sharing of information with other computing devices.

Abstract: A one-time-settable tamper resistant software repository may be used in any computing system to store system information such as security violations and policies for responding to them. A one-time-settable tamper resistant software repository may be cryptographically signed, encrypted with a per device key and accessible by only the most privileged software executed by a computing device, e.g., hypervisor or operating system kernel. A one-time-settable tamper resistant software repository may be mirrored in RAM for performance. Recordable event fields in a software repository may be one-time-settable without the ability to reset them in a field operation mode whereas they may be resettable in a different mode such as a manufacturing mode.

Abstract: Apparatus and methods are disclosed relating to semiconductor assemblies. A semiconductor assembly includes an interposer which may be constructed from a flexible material, such as a polyimide tape. A pattern of conductive traces disposed on a first surface of the interposer is in electrical communication with a semiconductor die attached to the first surface. Interconnect recesses accessible on the opposite second surface expose one or more conductive traces. A conductive element, such as a solder ball, disposed substantially within the interconnect recess allows the assembly to be mounted on a substrate or a similar assembly. By substantially containing the conductive element within the interconnect recess, the height of the completed assembly is reduced. Assemblies may be stacked to form multidie assemblies. Interconnect structures, such as connection pads, or enlarged traces upon the first surface are employed to connect stacked assemblies.

Abstract: Various techniques are described to protect secrets held by closed computing devices. In an ecosystem where devices operate and are offered a wide range of services from a service provider, the service provider may want to prevent users from sharing services between devices. In order to guarantee that services are not shared between devices, each device can be manufactured with a different set of secrets such as per device identifiers. Unscrupulous individuals may try to gain access to the secrets and transfer secrets from one device to another. In order to prevent this type of attack, each closed computing system can be manufactured to include a protected memory location that is tied to the device.

Abstract: A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer, a bump layer, and a non-oxidizing outer layer. The external contacts are smaller and more uniform than conventional solder balls, and can be fabricated using low temperature deposition processes, such that package warpage is decreased. Further, the external contacts can be shaped by etching to have generally planar tip portions that facilitate bonding to electrodes of a supporting substrate. Die contacts on the substrate can also be formed as multi layered metal bumps having generally planar tip portions, such that the die can be flip chip mounted to the substrate.

Abstract: Methods and arrangements are provided for use in multiple user computing environments. These methods and arrangements can be configured to allow for a plurality of separate and concurrent desktops and workspaces within the shared computing environment. One method includes creating a separate desktop thread for each user that is authenticated during a logon process, creating a separate desktop associated with each desktop thread, and maintaining a list of desktop threads that are created. In this manner, several users can be logged on simultaneously. In certain implementations, the method further includes establishing a separate user environment associated with each desktop and launching a separate user shell associated with each desktop. The list of desktop threads allows for selective and/or automatic switching from a first desktop to a second desktop without terminating a desktop thread associated with the first desktop. The methods and arrangements are also applicable to remote process logon and switching.

Abstract: Various embodiments of the present disclosure describe techniques for enforcing a subcomponent related security policy for closed computing systems. A closed computing system can include a list of subcomponents that identify the subcomponents it was manufactured with. The list can be used to determine if any currently attached subcomponents are different than the original ones. If a new subcomponent is detected, the device can perform a predetermined action in accordance with a security policy.

Abstract: Systems, methods, and computer readable media are disclosed for making dictionary based attacks difficult and/or time consuming for attackers. In one example embodiment, this can be accomplished by equipping a security service with software and/or circuitry operable to select security questions from different partitions of a question table.

Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.

Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.

Abstract: A method and computer-readable medium perform a pre-boot scan of an emulated binary to detect a function that is above a predetermined complexity threshold. The detected function may then be precompiled during a boot-up process. The pre-boot scan may also detect a function that falls below a second predetermined complexity threshold. The detected function may be placed inline with the code body. Just-in-time translation may then be performed at runtime.

Abstract: A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.

Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.