Abstract: A printed circuit board assembly incorporates an opening into which one or more integrated circuit packages at least partially fit, a plurality of electrical connection pads are disposed about the periphery of the opening, corresponding leads of the integrated circuit package are bonded to the pads, and the overall assembly is thinner than an assembly lacking the opening.

Abstract: Grounding a PCB to an enclosure sub-assembly is accomplished using a specially designed spring. The spring contains a base portion, an inclined portion and a head portion. Holes are provided in the base portion of the spring to allow for soldering to make a much stronger bond, reducing the chance of separation. A tab is provided on the top portion to reduce snagging nearby objects during installation. Notches are placed between the head portion and flaps connected to he head portion in order to reduce tearing that may occur during manufacture. The spring may then be used with a specially designed enclosure sub-assembly having a drawn feature, the drawn feature engaging the spring and compressing it, allowing grounding to occur. The drawn feature allows for the single spring design to be used in a wide variety of products.