Abstract: Miniature arm fire and safe and arm devices include an electrically operated pyrotechnic initiation device (5) to generate a detonation wave upon command and a movable pressure barrier (9) that blocks propagation of the detonation wave if the device is not intended to be fired and opens a window (12) to transfer the detonation wave externally of the device. The detonation wave may in alternate embodiments be a subsonic flame front and pressure wave or a supersonic shock wave, respectively. An electromagnet (7) may serve to move the pressure barrier. Detonation waves output from the device have application in igniting an explosive train, either directly or indirectly, the latter by operating an electrical switch. In the arm fire device, the barrier automatically prevents a detonation output when electrical power is removed from the device. In the safe and arm device, the barrier, once moved out of the way, remains out of the way, even when electrical power is removed.

Abstract: Packaging of microelectronics utilizing a series of various size cylinders hich are assembled and sealed from the environment, providing electrical connections out opposite ends of the cylinders and providing for a center opening in the inner cylinder to allow other structure such as a warhead to be mounted therein are aspects of this invention.

Abstract: Glass lead seal test apparatus in which a multiplicity of microcircuit pages with the leads sealed relative thereto by glass are checked for leakage between the glass seals and the microcircuit package structure and relative to the leads; this is accomplished by providing an apparatus for evacuating a chamber of the microcircuit packages and a chamber of the apparatus, and then injecting helium into the chamber of the apparatus and then utilizing test structure to test leakage around the glass seals if a perfect seal is not present. The device is designed to handle a multiplicity of microcircuit packages during a given test cycle.

Abstract: A plurality of fine leak test chambers for fast individual testing of herically plated microelectronic devices. Each microcircuit component, having already been subjected to a controlled environment of 5 percent helium and 95 percent nitrogen and then assembled, is placed in the chambers and sealed therein. The chambers are evacuated and helium flow rate (if present) is measured by a spectrometer.

Abstract: A pneumatic gross leak detector for testing micro-electronic packages. The pparatus includes a frame having a vertically movable upper section and a stationary lower section. A chamber is provided with walls which are secured to the upper section for movement therewith. The chamber includes upper, lower and intermediate portions disposed in communication. A test chamber base is secured to the lower stationary section to receive the microelectronic package therein. A first piston is provided in the upper chamber portion for moving the upper frame section downwardly for sealing engagement for the lower chamber portion with the test chamber base. A second piston is provided for compressing air in the lower chamber portion to a predetermined value. A readout device communicates into the test chamber to indicate if compressed air in the lower chamber leaks into the micro-electronic package.

Abstract: A process for depositing thick film electronic material which forms elect circuits on the inside wall of right circular substrates. The process includes the determination of a circuit pattern wherein a light sensor is used to actuate electronics which in turn controls the flow of the thick film paste for deposition on the substrate inside wall. The substrate is rotated and translated in conjunction with the movement of a light sensor in the x-y plane.