Patents by Inventor Victoria Bruce

Victoria Bruce has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240287485
    Abstract: The invention relates to modified Dda helicases which can be used to control the movement of polynucleotides and are particularly useful for sequencing polynucleotides.
    Type: Application
    Filed: March 5, 2024
    Publication date: August 29, 2024
    Applicant: Oxford Nanopore Technologies PLC
    Inventors: Andrew John Heron, Rebecca Victoria Bowen, Mark John Bruce, Lakmal Nishantha Jayasinghe, Joseph Hargreaves Lloyd, Szabolcs Soeroes, Elizabeth Jayne Wallace, Christopher Peter Youd
  • Publication number: 20240240245
    Abstract: Provided herein is a method of loading a motor protein onto a polynucleotide adapter. Also provided are polynucleotide adapters and kits comprising such adapters. The adapters find use in characterising analytes such as polynucleotides in methods in which the polynucleotide moves in respect of a nanopore.
    Type: Application
    Filed: May 22, 2020
    Publication date: July 18, 2024
    Applicant: Oxford Nanopore Technologies plc
    Inventors: Andrew John Heron, Mark John Bruce, Rebecca Victoria Bowen, Luke Alexander McNeill, Simon Rafael Villarreal, Samuel John Martin, Rebecca Anne Stafford-Allen
  • Publication number: 20170176520
    Abstract: An electro-optical analyzing system is provided with a wavelength tunable laser so that a DUT may be laser illuminated at different wavelengths. The signal qualities are determined corresponding to a reflection from the DUT of illumination of the laser at multiple wavelengths.
    Type: Application
    Filed: September 19, 2016
    Publication date: June 22, 2017
    Inventors: Ulrike Kindereit, Victoria Bruce
  • Patent number: 6844928
    Abstract: The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: January 18, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Glen P. Gilfeather, Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria Bruce, Michael Bruce, Rosalinda M. Ring, Daniel Stone
  • Patent number: 6700659
    Abstract: The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that can detect light leakage between a light source and a die. In one example embodiment of the present invention, a light source is directed to a semiconductor analysis arrangement using, for example, a fiber optic cable. The analysis arrangement is adapted to use light from the light source for analyzing the die. A light detection arrangement detects a condition of light leakage from the system and generates a signal representing the condition of light leakage. The generated signal can then be used to control the semiconductor analysis arrangement, such as by deactivating the light source in response to a detected leak, or by allowing the light source to function in response to not detecting a leak.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: March 2, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Srikar V. Chunduri, Glen P. Gilfeather, Brennan V. Davis, David H. Eppes, Victoria Bruce, Michael Bruce, Rosalinda M. Ring, Daniel Stone
  • Patent number: 6635839
    Abstract: Semiconductor die analysis is enhanced using a system that is adapted to perturb a die in a test chamber and to detect a response from the die to the perturbation. According to an example embodiment of the present invention, a semiconductor die analysis system includes a test chamber and a docking arrangement adapted to dock with the test chamber. A die is held in the docking arrangement and is presented inside of the test chamber when the docking arrangement is docked with the chamber. Two or more perturbation devices are used to perturb the die, and controller is adapted to control the perturbation. A data acquisition arrangement receives data from the die in response to the perturbation, and the data is used for analyzing the die.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: October 21, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Glen P. Gilfeather, Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria Bruce, Michael Bruce, Rosalinda M. Ring, Daniel Stone
  • Patent number: 6417068
    Abstract: According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device and exposing a selected region in the substrate. A laser is directed at a selected area of the back side of the device to create a small marker to be used for alignment during the milling process. The substrate is then milled to expose the selected area within the substrate, using the marker as alignment.
    Type: Grant
    Filed: February 8, 1999
    Date of Patent: July 9, 2002
    Assignee: Advance Micro Devices, Inc.
    Inventors: Victoria Bruce, Susan Li, Jeffrey D. Birdsley