Abstract: The optoelectronic module includes a photoreceptor circuit for picking up light from a light source by reflection on an external surface. The photoreceptor circuit and the light source circuit are mounted on a substrate, and contact pads of the circuits are electrically connected to pads of the substrate. The substrate pads are connected to conductive paths of the substrate. The flexible substrate includes a first portion on which the photoreceptor circuit and light source circuit are mounted and electrically connected, a second portion including electrical connection terminals and a connecting portion between the first portion and the second portion. This connecting portion connects some conductive paths of the first portion to the connection terminals of the second portion. The connecting portion allows the height and/or spacing of the second portion to be adjusted relative to the first portion when the module is mounted, particularly in a computer mouse.

Abstract: The optoelectronic circuit includes a photoreceptor (1) made in a silicon semiconductor substrate (4), and a monomode VCSEL laser diode (2) made in a gallium arsenide substrate. The photoreceptor includes at least one photosensitive area with a pixel array for picking up light and an area with a control and processing unit for the signals supplied by the pixels. The laser diode is mounted and electrically connected directly on one part of the photoreceptor. The laser diode is connected by a conductive terminal (12) to a first contact pad (3) at the bottom of a cavity (13) made through a passivation layer (5) of the photoreceptor. An electrode (17) on the top of the diode is connected by a metal wire (15) to a second contact pad (3) of the photoreceptor. The photoreceptor controls the diode directly via the electrode and the conductive terminal to generate a laser beam (L).

Abstract: The chip card (11) includes at least one integrated circuit (11) fitted with a memory unit, in which personal data and/or at least one chip card identification code and/or configuration parameters can be stored. The integrated circuit is enclosed in an insulating material (3) that forms said card. The chip card (1) also includes connecting means (2) for communicating with an electronic instrument. These connecting means are electrically connected to corresponding contact pads of the integrated circuit. The chip card further includes a measuring circuit with a sensor for measuring a physical parameter so as to provide at least one output signal relating to the measurement (SD) of the physical parameter. The measuring circuit containing a sensor is arranged in a rigid case to define an electronic module (10), which is enclosed in the insulating material (3) that forms said chip card.

Abstract: The integrated photoreceptor circuit includes a photosensitive area for picking up light and a processing unit area for processing the signals provided by the photosensitive area. This photoreceptor circuit includes electric contact pads, which are arranged symmetrically solely on the side of the processing unit area, which is juxtaposed with the photosensitive area. The integrated photoreceptor circuit is mounted on a first portion of a flexible substrate. The contact pads of the integrated photoreceptor circuit are electrically connected to electrical connection pads of the printed circuit of the flexible substrate. A second portion of the flexible substrate carries electrical connection terminals, which are connected to the connection pads via conductive paths, arranged in part on a connecting portion between the first and second portions. A through aperture in the first portion may be provided opposite the photosensitive area only of the photoreceptor circuit.

Abstract: The optoelectronic circuit includes a photoreceptor (1) made in a silicon semiconductor substrate (4), and a monomode VCSEL laser diode (2) made in particular in a gallium arsenide substrate. The photoreceptor includes at least one photosensitive area with a pixel array for picking up light and an area with a control and processing unit for the signals supplied by the pixels. The laser diode (2) is mounted and electrically connected directly on one part of the photoreceptor. This laser diode may be housed in a cavity (13) made through a passivation layer (5) of the photoreceptor, and connected by a conductive terminal (12) to a first contact pad (3) at the bottom of the cavity. An electrode (17) on the top of the diode can be connected by a metal wire (15) to a second neighbouring accessible contact pad (3) of the photoreceptor. The photoreceptor (1) controls the diode directly via the electrode and the conductive terminal to generate a laser beam (L).

Abstract: The integrated photoreceptor circuit includes a photosensitive area for picking up light and a processing unit area for processing the signals provided by the photosensitive area. This photoreceptor circuit includes electric contact pads, which are arranged symmetrically solely on the side of the processing unit area, which is juxtaposed with the photosensitive area. The integrated photoreceptor circuit is mounted on a first portion of a flexible substrate. The contact pads of the integrated photoreceptor circuit are electrically connected to electrical connection pads of the printed circuit of the flexible substrate. A second portion of the flexible substrate carries electrical connection terminals, which are connected to the connection pads via conductive paths, arranged in part on a connecting portion between the first and second portions. A through aperture in the first portion may be provided opposite the photosensitive area only of the photoreceptor circuit.

Abstract: The optoelectronic module (1) includes a photoreceptor circuit (3) for picking up light from a light source by reflection on an external surface. The photoreceptor circuit and the light source circuit are mounted on a substrate (2), and contact pads (6) of the circuits are electrically connected to pads of the substrate. The substrate pads are connected to conductive paths of the substrate. The flexible substrate includes a first portion (2a) on which the photoreceptor circuit (3) and light source circuit are mounted and electrically connected, a second portion (2b) including electrical connection terminals (9) and a connecting portion (2c) between the first portion and the second portion. This connecting portion connects some conductive paths of the first portion to the connection terminals of the second portion. The connecting portion allows the height and/or spacing of the second portion to be adjusted relative to the first portion when the module is mounted, particularly in a computer mouse.