Patents by Inventor Vidur Pandita

Vidur Pandita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer Defect Discovery
    Publication number: 20170076911
    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
    Type: Application
    Filed: November 22, 2016
    Publication date: March 16, 2017
    Inventors: Hong Chen, Kenong Wu, Martin Plihal, Vidur Pandita, Ravikumar Sanapala, Vivek Bhagat, Rahul Lakhawat, Oksen Baris, Rajesh Ramachandran, Naoshin Haque
  • Wafer defect discovery
    Patent number: 9518934
    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: December 13, 2016
    Assignee: KLA-Tencor Corp.
    Inventors: Hong Chen, Kenong Wu, Martin Plihal, Vidur Pandita, Ravikumar Sanapala, Vivek Bhagat, Rahul Lakhawat, Oksen Baris, Rajesh Ramachandran, Naoshin Haque
  • Wafer Defect Discovery
    Publication number: 20160123898
    Abstract: Systems and methods for discovering defects on a wafer are provided. One method includes detecting defects on a wafer by applying a threshold to output generated by a detector in a first scan of the wafer and determining values for features of the detected defects. The method also includes automatically ranking the features, identifying feature cut-lines to group the defect into bins, and, for each of the bins, determining one or more parameters that if applied to the values for the features of the defects in each of the bins will result in a predetermined number of the defects in each of the bins. The method also includes applying the one or more determined parameters to the output generated by the detector in a second scan of the wafer to generate a defect population that has a predetermined defect count and is diversified in the values for the features.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 5, 2016
    Inventors: Hong Chen, Kenong Wu, Martin Plihal, Vidur Pandita, Ravikumar Sanapala, Vivek Bhagat, Rahul Lakhawat, Oksen Baris, Rajesh Ramachandran, Naoshin Haque