Abstract: A structured document analyzer that associates keys and values in structured documents based on key, value, and key-value container bounding boxes. A trained machine learning model analyzes images of structured documents to determine bounding boxes for keys, values, and key-value containers in the images with confidence scores for the classifications. For each image, duplicate bounding boxes are removed, and then a set of key-value containers are selected and sorted based on the confidence scores. For each key-value container, a best key and value are determined for the container based on overlap of the key and value bounding boxes with the container bounding box and the confidence scores. Optical character recognition may be performed on the image to determine text for the keys and values.

Abstract: A method of encapsulating a substrate is disclosed, in which the substrate has at least the following layers: a CMOS device layer, a layer of first semiconductor material different to silicon, and a layer of second semiconductor material, the layer of first semiconductor material arranged intermediate the CMOS device layer and the layer of second semiconductor material. The method comprises: (i) circumferentially removing a portion of the substrate at the edges; and (ii) depositing a dielectric material on the substrate to replace the portion removed at step (i) for encapsulating at least the CMOS device layer and the layer of first semiconductor material. A related substrate is also disclosed.

Abstract: A method of encapsulating a substrate is disclosed, in which the substrate has at least the following layers: a CMOS device layer, a layer of first semiconductor material different to silicon, and a layer of second semiconductor material, the layer of first semiconductor material arranged intermediate the CMOS device layer and the layer of second semiconductor material. The method comprises: (i) circumferentially removing a portion of the substrate at the edges; and (ii) depositing a dielectric material on the substrate to replace the portion removed at step (i) for encapsulating at least the CMOS device layer and the layer of first semiconductor material. A related substrate is also disclosed.