Patents by Inventor Viet Dinh

Viet Dinh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11222961
    Abstract: A semiconductor device is disclosed, a substrate structure; a raised source region; a raised drain region; a separation region disposed laterally between the raised source region and the raised drain region; a gate structure, disposed between the raised source region and the raised drain region and above a part of the separation region, the gate structure being spaced apart from the drain region and defining a drain extension region therebetween; a dummy gate structure in the drain extension region; an epitaxial layer, disposed above and in contact with the substrate structure and forming the raised source region, the raised drain region, and a raised region between the gate structure and the dummy gate structure, wherein the raised region between the gate structure and the dummy gate structure is relatively lightly doped to a conductivity of a second conductivity type which is opposite the first conductivity type.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: January 11, 2022
    Assignee: NXP B.V.
    Inventors: Viet Dinh, Guido Sasse, Paul Grudowski
  • Publication number: 20200343368
    Abstract: A semiconductor device is disclosed, a substrate structure; a raised source region; a raised drain region; a separation region disposed laterally between the raised source region and the raised drain region; a gate structure, disposed between the raised source region and the raised drain region and above a part of the separation region, the gate structure being spaced apart from the drain region and defining a drain extension region therebetween; a dummy gate structure in the drain extension region; an epitaxial layer, disposed above and in contact with the substrate structure and forming the raised source region, the raised drain region, and a raised region between the gate structure and the dummy gate structure, wherein the raised region between the gate structure and the dummy gate structure is relatively lightly doped to a conductivity of a second conductivity type which is opposite the first conductivity type.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 29, 2020
    Inventors: Viet Dinh, Guido Sasse, Paul Grudowski
  • Patent number: 9111987
    Abstract: Consistent with an example embodiment, a bipolar transistor comprises an emitter region vertically separated from a collector region in a substrate by a base region. The bipolar transistor further comprises a field plate electrically connected to the emitter region; the field plate extends from the emitter region along the base region into the collector region and the field plate is laterally electrically insulated from the base region and the collector region by a spacer. The spacer comprises an electrically isolating material that includes a silicon nitride layer and is vertically electrically isolated from the substrate by a further electrically isolating material.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: August 18, 2015
    Assignee: NXP, B.V.
    Inventors: Evelyne Gridelet, Johannes Donkers, Petrus Hubertus Cornelis Magnee, Viet Dinh, Tony Vanhoucke
  • Publication number: 20140327110
    Abstract: Consistent with an example embodiment, a bipolar transistor comprises an emitter region vertically separated from a collector region in a substrate by a base region. The bipolar transistor further comprises a field plate electrically connected to the emitter region; the field plate extends from the emitter region along the base region into the collector region and the field plate is laterally electrically insulated from the base region and the collector region by a spacer. The spacer comprises an electrically isolating material that includes a silicon nitride layer and is vertically electrically isolated from the substrate by a further electrically isolating material.
    Type: Application
    Filed: April 23, 2014
    Publication date: November 6, 2014
    Applicant: NXP B.V.
    Inventors: Evelyne Gridelet, Johannes Donkers, Petrus Hubertus Cornelis Magnee, Viet Dinh, Tony Vanhoucke
  • Patent number: 7468763
    Abstract: System and method for an all-digital audio receiver for a BTSC MTS audio signal or other composite signal that is FM modulated. A preferred embodiment comprises a digital FM demodulator for receiving an analog to digital quantized SIF signal and performing demodulation and outputting a composite audio signal, and a digital audio processor for decomposing the composite audio signal into at least the SAP, stereo and monaural signals for audio reproduction. In a preferred embodiment, the digital audio processor is a programmable digital signal processor. In a preferred embodiment, the digital FM demodulator and the digital audio processor are implemented as an integrated circuit. Methods for processing the audio signal using the digital processors of the invention are provided.
    Type: Grant
    Filed: August 9, 2005
    Date of Patent: December 23, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Feng Ying, Karl Hertzian Renner, Weider Peter Chang, Shereef Shehata, Viet Dinh, Xiaodong Wu, Walter Heinrich Demmer
  • Publication number: 20070035667
    Abstract: System and method for an all-digital audio receiver for a BTSC MTS audio signal or other composite signal that is FM modulated. A preferred embodiment comprises a digital FM demodulator for receiving an analog to digital quantized SIF signal and performing demodulation and outputting a composite audio signal, and a digital audio processor for decomposing the composite audio signal into at least the SAP, stereo and monaural signals for audio reproduction. In a preferred embodiment, the digital audio processor is a programmable digital signal processor. In a preferred embodiment, the digital FM demodulator and the digital audio processor are implemented as an integrated circuit. Methods for processing the audio signal using the digital processors of the invention are provided.
    Type: Application
    Filed: August 9, 2005
    Publication date: February 15, 2007
    Inventors: Feng Ying, Karl Renner, Weider Chang, Shereef Shehata, Viet Dinh, Xiaodong Wu, Walter Demmer