Abstract: A liquid thermal interface material (LTIM) utilized in electronic devices includes a first part and a second part, where the first and second parts of the LTIM are individually synthesized. The first part and the second part are mixed together, dispensed into an electronic device, and the LTIM is at least partially cured. The first part comprises a dimethylpolysiloxane comprising resin, an oxide filler, a nitride filler, a catalyst comprising platinum, and a cyclohexanol comprising inhibitor. The second part comprises a polydimethylsiloxane comprising chain extender, a polymethylhydrosiloxane comprising crosslinker, a methylpolysiloxane comprising adhesive agent, the oxide filler, and the nitride filler. The cured LTIM has a thermal conductivity between about 4.5 W/mK to about 5.5 W/mK and a density less than about 2 g/cc. The cured LTIM does not bleed oil, thereby preventing contamination and damage of the electronic device.