Patents by Inventor Vijaveshwar Das Khanna

Vijaveshwar Das Khanna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis
    Patent number: 8056027
    Abstract: A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: November 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: Hien Phu Dang, Vijaveshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha
  • Characterizing Thermomechanical Properties of an Organic Substrate Using Three-Dimensional Finite Element Analysis
    Publication number: 20090312960
    Abstract: A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.
    Type: Application
    Filed: October 29, 2008
    Publication date: December 17, 2009
    Inventors: Hien Phu Dang, Vijaveshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha