Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: A pulse of terahertz radiation is transmitted through a touch panel formed of a dielectric material. The pulse generates an employable evanescent field in a region adjacent to a touch surface of the touch panel. The terahertz radiation has a frequency range between 0.1 terahertz and 10 terahertz. A reflected pulse is generated from an object located within the region adjacent to the touch surface of the touch panel. A position is triangulated of the object on the touch surface of the touch panel, based at least in part on the reflected pulse.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: A pulse of terahertz radiation is transmitted through a touch panel formed of a dielectric material. The pulse generates an employable evanescent field in a region adjacent to a touch surface of the touch panel. The terahertz radiation has a frequency range between 0.1 terahertz and 10 terahertz. A reflected pulse is generated from an object located within the region adjacent to the touch surface of the touch panel. A position is triangulated of the object on the touch surface of the touch panel, based at least in part on the reflected pulse.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: A method is provided. A first edge on a first gating signal is generated, and a local oscillator and a shared clocking circuit with the first edge on the first gating signal. A second edge on a second gating signal is generated following the first edge on the first gating signal, and a receiver circuit is activated with the second edge on the second gating signal, where the receiver circuit includes a mixer. A transmit pulse following the first edge on the first gating signal is generated with the transmit pulse having a third edge. A switch that short circuits outputs of the mixer is then released following the later of the third edge of the transmit pulse and a delay.

Abstract: An apparatus is provided. A plurality of transceiver antennas are arranged to form a phased array, where each antenna include a differential transmit antenna and a differential receive antenna arranged in a first pattern. A plurality of transceivers are arranged in a second pattern that is substantially symmetrical, and each transceiver is associated with at least one of the transceiver antennas and includes a feed network. Each feed network has a power amplifier (PA), a first matching network that is coupled between the PA and its associated transmit antenna so as to translate the phase of each differential transmit signal, a low noise amplifier (LNA), and a second matching network that is coupled between the LNA and its associated receive antenna so as to translate the phase of each differential receive signal.

Abstract: A loop antenna is provided. The apparatus comprises a substrate, a first metallization layer, and a second metallization layer. The substrate has first and second feed terminals and a ground terminal. The first metallization layer is disposed over the substrate and includes a first window conductive region, a first conductive region, a second conductive region, and a third conductive region. The first conductive region is disposed over and is in electrical contact with the first feed terminal; it is also is substantially circular and located within the first window region. The second conductive region is disposed over and is in electrical contact with the second feed terminal; it is also substantially circular and is located within the first window region. The a third conductive region is disposed over and is in electrical contact with the ground terminal, and the third conductive region substantially surrounds the first window region.

Abstract: An apparatus for emitting radiation is provided. The apparatus comprises an antenna formed on a substrate, and a high impedance surface (HIS). The HIS has a plurality of cells formed on the substrate that are arranged to form an array that substantially surrounds at least a portion of the antenna. Each cell generally includes a ground plane, first plate, second plate, and an interconnect. The ground plane is formed on the substrate, while the first plate (which is substantially rectangular) is formed over and coupled to the ground plane. The first plate for each cell is also arranged so as to form a first checkered pattern for the array. The second plate (which is substantially rectangular) is formed over and is substantially parallel to the first plate. The first and second plates are also substantially aligned with a central axis that extends generally perpendicular to the first and second plates hand have a interconnect formed therebetween.

Abstract: A method for providing a plurality of narrow pulses is provided. A first pulse having a first width is received by a delay line having a plurality of delay cells. This first pulse has a first width. In response to this first pulse, a plurality of second pulses is generated by the delay line, where each second pulse has a second width that is less than the first width. First and second delay pulses are also generated by the delay line, and a delay for each delay cell in the delay line can then be adjusted if a rising edge of the second delay pulse is misaligned with a falling edge of the first delay pulse.

Abstract: An apparatus is provided. Transmission line cells are formed in a first region. A first metallization layer is formed over the transmission line cells within a portion of the first region. At least a portion of the first metallization layer is electrically coupled to the plurality of transmission line cells. A second metallization layer is formed over the first metallization layer with an interconnect portion, and overlay portion, and a first balun. The interconnect portion at least partially extends into the first region, and the overlay portion is within the first region. The first balun winding is electrically coupled to the overlay portion and partially extends into a second region. The first region partially surrounds the second region. A third metallization layer is formed over the second metallization layer having a second balun winding within the second region, where the second winding is generally coaxial with the first balun winding.

Abstract: An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Abstract: A method is provided. A first edge on a first gating signal is generated, and a local oscillator and a shared clocking circuit with the first edge on the first gating signal. A second edge on a second gating signal is generated following the first edge on the first gating signal, and a receiver circuit is activated with the second edge on the second gating signal, where the receiver circuit includes a mixer. A transmit pulse following the first edge on the first gating signal is generated with the transmit pulse having a third edge. A switch that short circuits outputs of the mixer is then released following the later of the third edge of the transmit pulse and a delay.

Abstract: In higher order sigma-delta modulators (SDMs), there are oftentimes errors introduced by the digital-to-analog (DAC) switches. Namely, parasitic capacitances associated with switches can introduce second harmonic spurs. Here, however, compensation circuits and buffers are provided. The buffers bias the switches in saturation, and the compensation circuits provide a “ground boost” for the buffers. The combination of the buffer and compensation circuit reduces the second harmonic spur, while also improving the Signal-to-Noise Ratio (SNR) and Signal-to-Noise-plus-Distortion Ratio (SNDR).

Abstract: A method for determining the position of a target is provided. Several emitted pulses of terahertz radiations are emitted from a phased array (which has several transceivers) in consecutive cycles (typically). These emitted pulses are generally configured to be reflected by a target so as to be received by the phased array within a scan range (which includes a digitization window with several sampling periods). Output signals from each of the transceivers are then combined to generate a combined signal for each cycle. The combined signal in each sampling period within the digitization window for emitted pulses is averaged to generate an averaged signal for each sampling period within the digitization window. These averaged signals are then digitized.

Abstract: Blixers, which are a relatively recent development, have not be studied as extensively as many older circuit designs. Here, a blixer is provided that improves linearity and reduces noise over other conventional blixer designs. To accomplish this, the blixer provided here uses a differential amplifier and/or a dummy path within its mixing circuit to perform noise reduction (and improve linearity).

Abstract: Transmission lines employing transmission line units or elements within integrated circuits (ICs) are well-known. Typically, different heights for these transmission line units can vary the characteristics of the cell (and transmission line), and there is typically a tradeoff between impedance and space (layout) specifications. Here, a transmission line is provided, which is generally comprised of elements of the same general width, but having differing or tapered heights that allow for impedance adjustments for high frequency applications (i.e., 160 GHz). For example, a transmission line that is coupled to a balun, with the transmission line units decreasing in height near the balun's center tap to adjust the impedance of the transmission line for the balun, is shown.