Abstract: An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.

Abstract: An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.

Abstract: An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.

Abstract: A method for removing a die from a plastic package. The first step of the method is to remove the package's cap. Next, the package and the die within it are placed on a hot plate and heated up. When the plastic package's temperature reaches a certain limit, the plastic package cracks, resulting in at least one fracture in the package. Each side of the cracked plastic package along the fracture is then grasped by a pair of pliers and the two pairs of pliers are pulled in opposite directions. As a result, the die is detached from the plastic package.

Abstract: A method and apparatus for maximizing passive voltage contrast on the surface of a die and then using the maximized passive voltage contrast to identify electrical failures in the die. The method employs a primary electron beam to scan the surface of the die. In response, secondary electrons are emitted from the die and then captured by a secondary electron detector. The density of secondary electrons is further modulated by a passive voltage near the die surface. To enhance the passive voltage contrast on the die surface, the incident angle of the primary electron beam is adjusted with respect to the die, the passive voltage contrast reaching a maximum at an incident angle of about 75° or above. With such enhanced contrast, an image depicting the magnitude of the secondary electron current can be used to detect electrical failures in the die.