Abstract: Exemplary semiconductor processing methods may include providing one or more deposition precursors to a semiconductor processing chamber. A substrate may be disposed within a processing region of the semiconductor processing chamber. The methods may include depositing a silicon-containing material on the substrate and on one or more components of the semiconductor processing chamber. The methods may include providing a fluorine-containing precursor to the processing region. The fluorine-containing precursor may be plasma-free when provided to the processing region. The methods may include contacting the silicon-containing material on the one or more components of the semiconductor processing chamber with the fluorine-containing precursor. The methods may include removing at least a portion of the silicon-containing material on the one or more components of the semiconductor processing chamber with the fluorine-containing precursor.

Abstract: The invention pertains to certain composite materials featuring strong direct bonds between certain fluoropolymers and polyamides, which can be formed by using as additive certain chlorotrifluoroethylene-containing elastomers, in an ionic curable blend.

Abstract: The present disclosure relates to a process for preparing of high thermal conductivity and high heat capacity oriented ultrahigh molecular weight polyethylene (UHMWPE) product. The process includes feeding UHMWPE through rollers to obtain a pre-laminate which is further hot stretched to obtain the oriented UHMWPE product having high thermal conductivity and high heat capacity. The temperature of stretching is maintained below the melt temperature of the UHMWPE throughout the entire process. There is also provided a high thermal conductivity and high heat capacity oriented UHMWPE product prepared by the process of the present disclosure. The oriented UHMWPE product is characterized in the axial thermal conductivity in the range of 70 to 200 W/mK, transverse direction thermal conductivity in the range of 0.022 to 0.045 W/mK and heat capacity in the range of 6 to 25 MJ/m3K.

Abstract: The present disclosure relates to a process for preparing of high thermal conductivity and high heat capacity oriented ultrahigh molecular weight polyethylene (UHMWPE) product. The process includes feeding UHMWPE through rollers to obtain a pre-laminate which is further hot stretched to obtain the oriented UHMWPE product having high thermal conductivity and high heat capacity. The temperature of stretching is maintained below the melt temperature of the UHMWPE throughout the entire process. There is also provided a high thermal conductivity and high heat capacity oriented UHMWPE product prepared by the process of the present disclosure. The oriented UHMWPE product is characterized in the axial thermal conductivity in the range of 70 to 200 W/mK, transverse direction thermal conductivity in the range of 0.022 to 0.045 W/mK and heat capacity in the range of 6 to 25 MJ/m3K.