Patents by Inventor Vijay Mehta

Vijay Mehta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957681
    Abstract: Imatinib is approved and marketed in solid oral dosage forms which may be dispersed in water or apple juice for patients having swallowing difficulty. Dispersion of Imatinib solid dosage forms in apple juice may increase palatability and patient compliance but apple juice may not be available all the time for administration. Further, dispersion of Imatinib solid oral dosage forms may not administer correct and consistent dose of medicine every time. The present invention therefore provides liquid dosage forms of Imatinib which correctly and consistently administers correct dose of drug to the patients.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 16, 2024
    Assignee: SHORLA PHARMA LIMITED
    Inventors: Sandip Mehta, Vijay Patel, Manish Umrethia, Jayanta Kumar Mandal
  • Patent number: 11962681
    Abstract: Features for providing a secure method of symmetric encryption for private smart contacts among multiple parties in a private peer-to-peer network. The features include a master key representing a unique blockchain ledger. The master key may be shared among multiple participants in a private peer-to-peer network. Sharing of the master key may include communicating the master key in an encrypted message (e.g., email) using public key infrastructure (PKI). In some implementations, more complex distribution features may be includes such as quantum entanglement. The features support instantiation of a smart contract using a specific master key. The request may be submitted as an entry to the ledger with appropriate metadata and/or payload information for identifying and processing the request.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: April 16, 2024
    Assignee: Experian Information Solutions, Inc.
    Inventors: Vijay Mehta, Alexander Phan
  • Publication number: 20240105341
    Abstract: A method for estimating tumor growth dynamics includes obtaining, by one or more processors, progression-free survival (PFS) data for a plurality of patients, the PFS data indicating (i) a plurality of observation times, and (ii) how many of the plurality of patients, at each of the plurality of observation times, had a PFS event within a most recent time window; determining, by the one or more processors and based on the PFS data, a population distribution for one or more patient-specific parameters; obtaining, by the one or more processors, measured tumor growth data for a particular patient subject to a drug treatment; estimating, by the one or more processors, tumor growth for the particular patient based on (i) the measured tumor growth data and (ii) the population distribution for the one or more patient-specific parameters; and causing, by the one or more processors, a display to present a visual indication of the estimated tumor growth for the particular patient.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Inventors: Arya POURZANJANI, Khamir MEHTA, Vijay Vishesh UPRETI
  • Patent number: 11921861
    Abstract: Methods, systems, and computer program products for providing the status of model extraction in the presence of colluding users are provided herein. A computer-implemented method includes generating, for each of multiple users, a summary of user input to a machine learning model; comparing the generated summaries to boundaries of multiple feature classes within an input space of the machine learning model; computing correspondence metrics based at least in part on the comparisons; identifying, based at least in part on the computed metrics, one or more of the multiple users as candidates for extracting portions of the machine learning model in an adversarial manner; and generating and outputting an alert, based on the identified users, to an entity related to the machine learning model.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: March 5, 2024
    Assignee: International Business Machines Corporation
    Inventors: Manish Kesarwani, Vijay Arya, Sameep Mehta
  • Publication number: 20240048357
    Abstract: Features for providing a secure method of symmetric encryption for private smart contacts among multiple parties in a private peer-to-peer network. The features include a master key representing a unique blockchain ledger. The master key may be shared among multiple participants in a private peer-to-peer network. Sharing of the master key may include communicating the master key in an encrypted message (e.g., email) using public key infrastructure (PKI). In some implementations, more complex distribution features may be includes such as quantum entanglement. The features support instantiation of a smart contract using a specific master key. The request may be submitted as an entry to the ledger with appropriate metadata and/or payload information for identifying and processing the request.
    Type: Application
    Filed: April 4, 2023
    Publication date: February 8, 2024
    Inventors: Vijay Mehta, Alexander Phan
  • Patent number: 11652607
    Abstract: Features for providing a secure method of symmetric encryption for private smart contacts among multiple parties in a private peer-to-peer network. The features include a master key representing a unique blockchain ledger. The master key may be shared among multiple participants in a private peer-to-peer network. Sharing of the master key may include communicating the master key in an encrypted message (e.g., email) using public key infrastructure (PKI). In some implementations, more complex distribution features may be includes such as quantum entanglement. The features support instantiation of a smart contract using a specific master key. The request may be submitted as an entry to the ledger with appropriate metadata and/or payload information for identifying and processing the request.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: May 16, 2023
    Assignee: Experian Information Solutions, Inc.
    Inventors: Vijay Mehta, Alexander Phan
  • Patent number: 11545441
    Abstract: Semiconductor packages and package assemblies having active dies and external die mounts on a silicon wafer, and methods of fabricating such semiconductor packages and package assemblies, are described. In an example, a semiconductor package assembly includes a semiconductor package having an active die attached to a silicon wafer by a first solder bump. A second solder bump is on the silicon wafer laterally outward from the active die to provide a mount for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer above the second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die can be connected directly to the second solder bump on the silicon wafer through the hole.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: January 3, 2023
    Assignee: Intel Corporation
    Inventors: Vipul Vijay Mehta, Eric Jin Li, Sanka Ganesan, Debendra Mallik, Robert Leon Sankman
  • Publication number: 20210182959
    Abstract: Systems and methods for providing and executing a data processing tool are disclosed. The data processing tool may include an attribute processing agent which may be embedded in a database system. The attribute processing agent can receive input data and a custom-made attribute as an input and process the input data in accordance with the custom-made attribute. In some embodiments, there may be multiple attribute processing agents distributed in multiple computing nodes. Each attribute processing agent may be configured to process a portion of a data set based on the storage location of the portion of the data set.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 17, 2021
    Inventors: Don Lennert, William Maynard, Vijay Mehta, Thomas Huss
  • Publication number: 20210082826
    Abstract: Semiconductor packages and package assemblies having active dies and external die mounts on a silicon wafer, and methods of fabricating such semiconductor packages and package assemblies, are described. In an example, a semiconductor package assembly includes a semiconductor package having an active die attached to a silicon wafer by a first solder bump. A second solder bump is on the silicon wafer laterally outward from the active die to provide a mount for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer above the second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die can be connected directly to the second solder bump on the silicon wafer through the hole.
    Type: Application
    Filed: November 24, 2020
    Publication date: March 18, 2021
    Inventors: Vipul Vijay MEHTA, Eric Jin LI, Sanka GANESAN, Debendra MALLIK, Robert Leon SANKMAN
  • Patent number: 10910317
    Abstract: Semiconductor packages and package assemblies having active dies and external die mounts on a silicon wafer, and methods of fabricating such semiconductor packages and package assemblies, are described. In an example, a semiconductor package assembly includes a semiconductor package having an active die attached to a silicon wafer by a first solder bump. A second solder bump is on the silicon wafer laterally outward from the active die to provide a mount for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer above the second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die can be connected directly to the second solder bump on the silicon wafer through the hole.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 2, 2021
    Assignee: Intel Corporation
    Inventors: Vipul Vijay Mehta, Eric Jin Li, Sanka Ganesan, Debendra Mallik, Robert Leon Sankman
  • Patent number: 10735183
    Abstract: Features for providing a secure method of symmetric encryption for private smart contacts among multiple parties in a private peer-to-peer network. The features include a master key representing a unique blockchain ledger. The master key may be shared among multiple participants in a private peer-to-peer network. Sharing of the master key may include communicating the master key in an encrypted message (e.g., email) using public key infrastructure (PKI). In some implementations, more complex distribution features may be includes such as quantum entanglement. The features support instantiation of a smart contract using a specific master key. The request may be submitted as an entry to the ledger with appropriate metadata and/or payload information for identifying and processing the request.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 4, 2020
    Assignee: Experian Information Solutions, Inc.
    Inventors: Vijay Mehta, Alexander Phan
  • Publication number: 20190279938
    Abstract: Semiconductor packages and package assemblies having active dies and external die mounts on a silicon wafer, and methods of fabricating such semiconductor packages and package assemblies, are described. In an example, a semiconductor package assembly includes a semiconductor package having an active die attached to a silicon wafer by a first solder bump. A second solder bump is on the silicon wafer laterally outward from the active die to provide a mount for an external die. An epoxy layer may surround the active die and cover the silicon wafer. A hole may extend through the epoxy layer above the second solder bump to expose the second solder bump through the hole. Accordingly, an external memory die can be connected directly to the second solder bump on the silicon wafer through the hole.
    Type: Application
    Filed: December 29, 2016
    Publication date: September 12, 2019
    Inventors: Vipul Vijay MEHTA, Eric Jin LI, Sanka GANESAN, Debendra MALLIK, Robert Leon SANKMAN
  • Publication number: 20180189871
    Abstract: Systems and methods for providing and executing a data processing tool are disclosed. The data processing tool may include an attribute processing agent which may be embedded in a database system. The attribute processing agent can receive input data and a custom-made attribute as an input and process the input data in accordance with the custom-made attribute. In some embodiments, there may be multiple attribute processing agents distributed in multiple computing nodes. Each attribute processing agent may be configured to process a portion of a data set based on the storage location of the portion of the data set.
    Type: Application
    Filed: January 3, 2017
    Publication date: July 5, 2018
    Inventors: Don Lennert, William Maynard, Vijay Mehta, Thomas Huss
  • Patent number: 8309043
    Abstract: The present invention provides a process for recovering Li values from a sodium saturated brine. The process includes recovering Li values from a sodium saturated brine which contains LiX. The process includes concentrating the sodium saturated brine to at least 9000 mg/l LiX, passing the concentrated brine through a bed of polycrystalline hydrated alumina pellets until the pellets are loaded with LiX from the concentrated brine, displacing brine held-up in the bed by using concentrated NaX, unloading LiX from the pellets by flowing through the bed an aqueous solution of LiX which is not saturated, displacing the LiX from the bed using concentrated NaX, and repeating the steps at least one additional time to provide the Li values.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: November 13, 2012
    Assignee: FMC Corporation
    Inventors: Pablo Alurralde, Vijay Mehta
  • Publication number: 20120141342
    Abstract: The present invention provides a process for recovering Li values from a sodium saturated brine. The process includes recovering Li values from a sodium saturated brine which contains LiX. The process includes concentrating the sodium saturated brine to at least 9000 mg/l LiX, passing the concentrated brine through a bed of polycrystalline hydrated alumina pellets until the pellets are loaded with LiX from the concentrated brine, displacing brine held-up in the bed by using concentrated NaX, unloading LiX from the pellets by flowing through the bed an aqueous solution of LiX which is not saturated, displacing the LiX from the bed using concentrated NaX, and repeating the steps at least one additional time to provide the Li values.
    Type: Application
    Filed: November 3, 2011
    Publication date: June 7, 2012
    Inventors: Pablo Alurralde, Vijay Mehta
  • Patent number: 7458928
    Abstract: A method and apparatus for a centrifuge energy management system prevents the energy level of a rotor from exceeding a predetermined containment limit for the centrifuge by monitoring the energy level and either terminating a run operation of the centrifuge if it surpasses the containment limit or reducing the rotational speed of the rotor.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: December 2, 2008
    Assignee: Kendro Laboratory Products, LP
    Inventors: David M. Carson, Vijay Mehta, Harvey Schneider
  • Publication number: 20070063169
    Abstract: A deicing composition is provided. The composition includes a potassium or sodium salt of a carboxylic acid and a lithium salt of a carboxylic acid or lithium nitrate, wherein the molar ratio of lithium to potassium or lithium to sodium is from 10 percent to 80 percent.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 22, 2007
    Inventors: David Stokes, Daniel Johnston, Prasada Rangaraju, Vijay Mehta, Claudio Manissero
  • Publication number: 20040033878
    Abstract: A method and apparatus for a centrifuge energy management system prevents the energy level of a rotor from exceeding a predetermined containment limit for the centrifuge by monitoring the energy level and either terminating a run operation of the centrifuge if it surpasses the containment limit or reducing the rotational speed of the rotor.
    Type: Application
    Filed: May 20, 2003
    Publication date: February 19, 2004
    Applicant: Kendro Laboratory Products, LP
    Inventors: David M. Carson, Vijay Mehta, Harvey Schneider
  • Publication number: 20030199379
    Abstract: Methods and apparatus for a centrifuge lock for use in centrifuge systems, which are particularly suited for centrifuge lock touch screen controls which can be manually set to unlock the centrifuge for easy access without the need for a physical key.
    Type: Application
    Filed: April 17, 2003
    Publication date: October 23, 2003
    Applicant: Kendro Laboratory Products, LP
    Inventors: Harvey Schneider, Vijay Mehta, Karl Kregling, Suzanne Anderson