Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

Abstract: A method of assembling a printed circuit (PC) boards with ultrafine pitch components. The method comprises: attaching a coarse pitch components on the PC board; applying solvent to the thermal pads of the ultrafine pitch components; mounting a die-attach film on the thermal pads; curing the die-attach film; applying solvent to the die-attach film; forming component leads for the ultrafine pitch components; aligning the ultrafine pitch components to the solder pads; attaching the component leads to the solder pads and the ultrafine pitch components to the thermal pads. Other devices, systems and methods are also disclosed.

Abstract: A method and apparatus for non-destructively detecting pressure contact open types of solder connections transmits acoustic emissions through an electronic component and the carrier upon which the electronic component is mounted by one or more solder connections. Emissions which are transmitted through the solder connections and which will interact with acoustic emissions generated if pressure contact opens are present are analyzed by comparison with the signal which is used to cause emissions to detect the presence of pressure contact opens by comparison of one or more of harmonics, energy, count, voltage, duration, rise time and time delay. A housing is preferably used to position a pair of transducers at respective locations which have solder connections topologically intervening therebetween. The testing process can thus be automated for screening assembled devices for the presence of pressure contact opens.