Abstract: At least one critical path is determined of a plurality of paths in a network of logic elements. In addition, a plurality of original cells is determined in a critical path of the at least one critical path. Each intermediate output of the plurality of original cells is unconnected to any input external to the plurality of original cells. The plurality of original cells performs a particular logic function. Furthermore, the plurality of original cells are replaced with at least one replacement cell that performs the particular logic function. A number of cells of the at least one replacement cell is less than a number of cells of the plurality of original cells. The plurality of paths may be between a first memory stage and a second memory stage, and each of the at least one critical path may have a delay greater than a delay threshold.

Abstract: A double patterned CMOS device includes a first set of stacked transistors, a second set of stacked transistors, and a set of transistors. The first set of stacked transistors includes first and second transistors. The first transistor has a first transistor active region and the second transistor has a second transistor active region. The second set of stacked transistors is adjacent the first set of stacked transistors. The second set of stacked transistors includes third and fourth transistors. The third transistor has a third transistor active region and the fourth transistor has a fourth transistor active region. The set of transistors is adjacent the first set of stacked transistors. The set of transistors includes a fifth transistor. The fifth transistor has a fifth transistor active region. The first, second, third, and fourth transistor active regions satisfy certain distance relationships from each other.

Abstract: A standard cell CMOS device includes a first power rail extending across the standard cell. The first power rail is connected to one of a first voltage or a second voltage less than the first voltage. The device further includes a second power rail extending across the standard cell. The second power rail is connected to an other one of the first voltage or the second voltage. The second power rail includes a metal x layer interconnect and a set of metal x?1 layer interconnects connected to the metal x layer interconnect. The device further includes a set of CMOS transistor devices between the first and second power rails and powered by the first and second power rails. The device further includes an x?1 layer interconnect extending under and orthogonal to the second power rail. The x?1 layer interconnect is coupled to the set of CMOS transistor devices.

Abstract: A CMOS device includes a PMOS transistor and an NMOS transistor. The CMOS device further includes a poly interconnect connecting together a drain of the PMOS transistor and a drain of the NMOS transistor. The poly interconnect may be located on an edge of a standard cell including the device. The CMOS device may further include a first interconnect on an MD layer connecting the drain of the PMOS transistor to the poly interconnect, and a second interconnect on the MD layer connecting the drain of the NMOS transistor to the poly interconnect. The PMOS transistor and the NMOS transistor may operate as a CMOS inverter. The CMOS device may be a tristate inverter, and specifically, a tristate inverter within a latch array.

Abstract: Gridded polysilicon semiconductor layouts implement double poly patterning to cut polylines of the layout into polyline segments. Devices are arranged on the polyline segments of a common polyline to reduce the area used to implement a circuit structure relative to conventional gridded polysilicon layout. Stacking of PMOS and NMOS devices is enabled by using double poly patterning to implement additional cuts which form additional polyline segments. Metal layer routing may connect nodes of separate polyline segments.