Patents by Inventor Vijayaraghavan RAJAGOPAL

Vijayaraghavan RAJAGOPAL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105663
    Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
    Type: Application
    Filed: September 29, 2023
    Publication date: March 28, 2024
    Inventors: Vijayaraghavan RAJAGOPAL, Eugene Anthony PRUSS, Richard F. HILL
  • Patent number: 11776928
    Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: October 3, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Vijayaraghavan Rajagopal, Eugene Anthony Pruss, Richard F. Hill
  • Publication number: 20220246572
    Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
    Type: Application
    Filed: March 14, 2022
    Publication date: August 4, 2022
    Inventors: Vijayaraghavan RAJAGOPAL, Eugene Anthony PRUSS, Richard F. HILL
  • Patent number: 11276662
    Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 15, 2022
    Inventors: Vijayaraghavan Rajagopal, Eugene Anthony Pruss, Richard F. Hill
  • Publication number: 20190348388
    Abstract: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 14, 2019
    Inventors: Vijayaraghavan RAJAGOPAL, Eugene Anthony PRUSS, Richard F. HILL