Patents by Inventor Vijayashree Subramanyam

Vijayashree Subramanyam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of metallization using a nickel-vanadium layer
    Publication number: 20020093101
    Abstract: A method of metallization comprising forming a conductive layer comprising nickel and vanadium inside an opening. The conductive layer comprising nickel and vanadium can be used as a barrier layer to prevent interlayer metal diffusion. Alternatively, the conductive layer can also be used as a seed layer for subsequent metal electroplating. In one embodiment, the conductive layer is used as an integrated barrier and seed layer for subsequent copper plating for submicron applications.
    Type: Application
    Filed: June 13, 2001
    Publication date: July 18, 2002
    Inventors: Subramoney Iyer, Murali Narasimhan, Murali Abburi, Vijayashree Subramanyam