Abstract: An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate.

Abstract: An organic substrate and method of making with optimal thermal warp characteristics is disclosed. The organic substrate has one or more top layers and one or more bottom layers. A chip footprint region is a surface region on each of the top and bottom layers that is defined as the projection of one or more semiconductor chips (chips) on the surface of each of the top and bottom layers. One or more top removal patterns are located on and may or may not remove material from the surface of one or more of the top layers within the chip footprint region of the respective top layer. One or more bottom removal patterns are located on and remove material from the surface of one or more of the bottom layers outside the chip footprint region of the respective bottom layer. The removal of the material from one or more of the top layers and/or bottom layers changes and optimizes a thermal warp of the organic substrate.

Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

Abstract: Embodiments of the present invention pertain to an apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, the disk drive shock absorber includes an assembly joint and a flexure. The flexure is capable of being coupled to the assembly joint. The assembly joint is capable of being coupled to the flexure and the computer system's chassis. The shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.

Abstract: Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.

Abstract: A hard disk drive has a motion limiting element mechanically constraining movement of a suspension of the disk drive away from a disk of the disk drive in the event of a mechanical shock to the disk drive while operating such that an air bearing between the slider on the suspension and the disk is not substantially disrupted.

Abstract: A disk drive controller establishes an active region on a disk that corresponds to a region of the disk wherein effects of mechanical shock to the disk drive during read and/or write operations are mitigated by a motion limiting element. The controller stores data in the active region based on frequency and/or recency of access of the data.

Abstract: A disk drive system, includes an arm for mounting a head, and at least one component, coupled to the arm, for being synchronized to maintain a zero net angular momentum of the arm and the at least one component. Another disk drive system including a read/write head, includes a torque counter-generating member for being synchronized to maintain a zero net angular momentum of the head.

Abstract: In a direct access storage device having a head for interaction with a storage medium and a moving actuator on which the head is mounted, the improvement comprises a compound bearing system for the actuator, the bearing system including a first bearing of low friction for small movements of the actuator; and a second bearing of higher friction for coarse movements of the actuator. The storage medium is preferably a rotating magnetic disk having a series of concentric circular tracks. A single servo system drives the actuator so that the head follows a selected track with motion of the first bearing, and movement of the head to a new track causes motion of the second bearing. Preferably the first bearing is a flex bearing and the second bearing is a ball bearing.

Abstract: In a computer apparatus including an enclosure and a direct access storage device mounted within the enclosure, a mounting apparatus for the direct access storage device including: a plurality of a relatively rigid shock isolators and at least one stress sensor mounted in series with are of said shock isolators and disposed between the enclosure and the direct access storage device. The enclosure may include a user frame and the mounting apparatus may be disposed between the direct access storage device and the frame. There may be one stress sensor for each of the shock isolators. The shock isolators may be coupled to the direct access storage device. Each stress sensor may include a piezoelectric element. Preferably the shock isolators are rigid enough so that the resonant frequency of said mounting apparatus is at least 800 Hz, but can be 800 Hz or higher.

Abstract: When an HDD is subjected to shock with a magnetic head (22) retracted to the parking zone, a suspension (34) having a magnetic head (36) at the free end thereof swings. When a lowest suspension (34) swings, the free end of the suspension (34) is brought into contact with a pin projection (50) and further displacement toward the base (12) is impeded. The suspension (34) that further swings in this condition presents not a swing in a primary mode (cantilever support mode) but a swing in a secondary mode (two-point support mode), and the maximum displacement of the suspension (34) occurs at the longitudinal intermediate portion of the suspension (34). The intermediate portion that is displaced is made to go into a groove (48), and the contact of the intermediate portion of the suspension (34) with the base (12) is impeded by the groove (48).