Patents by Inventor Vijaykumar Sundermurthy

Vijaykumar Sundermurthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8546186
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: October 1, 2013
    Assignee: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Publication number: 20130005084
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 3, 2013
    Applicant: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Patent number: 8148201
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: April 3, 2012
    Assignee: Starkey Laboratories, Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Publication number: 20100009498
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: September 21, 2009
    Publication date: January 14, 2010
    Applicant: Starkey Laboratories,Inc.
    Inventors: Craig Dumas, Vijaykumar Sundermurthy
  • Publication number: 20080272496
    Abstract: Described herein is an electronic device in which one or more planar interconnect structure are interposed between two substrates each incorporating a hybrid circuit. The planar interconnect structure has a plurality of conductive traces formed on one of its faces for electrically connecting sets of interconnection points of each of the hybrid circuits.
    Type: Application
    Filed: May 2, 2007
    Publication date: November 6, 2008
    Inventors: Craig Dumas, Vijaykumar Sundermurthy