Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: A microelectronic device includes a magnetic component having a first magnetic core segment and a second magnetic core segment, with a winding lamina between them. The first magnetic core segment includes a winding support portion with ferromagnetic material. The winding lamina is attached to the winding support portion. The first magnetic core segment also includes an extension portion with ferromagnetic material extending from the winding support portion. The winding lamina has winding loops of electrically conductive material that surround ferromagnetic material. A filler material is formed between the winding lamina and the first magnetic core segment, contacting both the winding lamina and the first magnetic core segment. The second magnetic core segment is attached to the extension portion of the first magnetic core segment. The second magnetic core segment includes ferromagnetic material. The winding loops are electrically coupled to external leads through electrical connections.

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

Abstract: For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

Abstract: A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.

Abstract: For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

Abstract: Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.

Abstract: A transformer for module integration includes a first layer of magnetic material having an outer edge, a second layer of magnetic material having an outer edge, and an isolation layer positioned between the first layer of magnetic material and the second layer of magnetic material along a primary axis. The transformer includes a first inductive element positioned in the first layer of magnetic material and a second inductive element disposed opposite of the first inductive element and in the second layer of magnetic material.

Abstract: Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.

Abstract: A semiconductor package is provided that has a transformer formed within a multilayer dielectric laminate substrate. The transformer has a first inductor coil formed in one or more dielectric laminate layers of the substrate, a second inductor coil formed in one or more dielectric laminate layers of the substrate, and an isolation barrier comprising two or more dielectric laminate layers of the multilayer substrate positioned between the first inductor coil and the second inductor coil. The transformer may be mounted on a lead frame along with one or more integrated circuits and molded into a packaged isolation device.

Abstract: A semiconductor package is provided that has a transformer formed within a multilayer dielectric laminate substrate. The transformer has a first inductor coil formed in one or more dielectric laminate layers of the substrate, a second inductor coil formed in one or more dielectric laminate layers of the substrate, and an isolation barrier comprising two or more dielectric laminate layers of the multilayer substrate positioned between the first inductor coil and the second inductor coil. The transformer may be mounted on a lead frame along with one or more integrated circuits and molded into a packaged isolation device.

Abstract: An inductor device having an improved galvanic isolation layer arranged between a pair of coil and methods of its construction are described.

Abstract: An inductor device having an improved galvanic isolation layer arranged between a pair of coil and methods of its construction are described.