Patents by Inventor VIKAS JANGRA

VIKAS JANGRA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Atomic layer deposition chamber with thermal lid
    Patent number: 10407771
    Abstract: Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: September 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Anqing Cui, Faruk Gungor, Dien-Yeh Wu, Vikas Jangra, Muhammad M. Rasheed, Wei V. Tang, Yixiong Yang, Xiaoxiong Yuan, Kyoung-Ho Bu, Srinivas Gandikota, Yu Chang, William W. Kuang
  • ATOMIC LAYER DEPOSITION CHAMBER WITH THERMAL LID
    Publication number: 20160097119
    Abstract: Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 7, 2016
    Inventors: ANQING CUI, FARUK GUNGOR, DIEN-YEH WU, VIKAS JANGRA, MUHAMMAD M. RASHEED, WEI V. TANG, YIXIONG YANG, XIAOXIONG YUAN, KYOUNG-HO BU, SRINIVAS GANDIKOTA, YU CHANG, WILLIAM W. KUANG