Patents by Inventor Vikas Kundapura Rao

Vikas Kundapura Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230422389
    Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.
    Type: Application
    Filed: June 29, 2023
    Publication date: December 28, 2023
    Inventors: Prabhakar Subrahmanyam, Tejas J. Shah, Yi Xia, Ying-Feng Pang, Mark Lawrence Bianco, Vishnu Prasadh Sugumar, Vikas Kundapura Rao, Srinivasa Rao Damaraju, Ridvan Amir Sahan, Emad Shehadeh Al-Momani, Rahima Khatun Mohammed, Mirui Wang, Devdatta Prakash Kulkarni
  • Publication number: 20230035081
    Abstract: A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.
    Type: Application
    Filed: September 29, 2022
    Publication date: February 2, 2023
    Applicant: Intel Corporation
    Inventors: Smit Kapila, VMK Sarma Vedhanabhatla, Vikas Kundapura Rao, David Rittenhouse