Patents by Inventor Vikas Manan

Vikas Manan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10068817
    Abstract: A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: September 4, 2018
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventors: Paul Bovaird, Stefano D'Agostino, Vikas Manan
  • Publication number: 20170271221
    Abstract: A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.
    Type: Application
    Filed: March 20, 2017
    Publication date: September 21, 2017
    Inventors: Paul Bovaird, Stefano D'Agostino, Vikas Manan
  • Patent number: 8054128
    Abstract: A current control mechanism for use in low power consumption circuits with limited headroom includes a differential transistor pair from whose collectors a current output is taken. The current output is a function of a reference voltage provided at bases of a reference transistor pair having emitters that are coupled to the bases of the differential pair. The reference voltage is controlled by a pair of control transistors that control current through a load. A pair of tracking transistors can be provided to track supply voltage. A single-ended topology can also be implemented.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: November 8, 2011
    Assignee: GigOptix, Inc.
    Inventor: Vikas Manan
  • Patent number: 8008904
    Abstract: A current supply circuit provides current that is substantially invariant with voltage supply and temperature changes. The current supply circuit has an input node connectable to a voltage supply and an output node operable to provide an output current. The current supply circuit includes a current source circuit coupled to a reference voltage node and configured to provide the output current at the output node, wherein a voltage at the reference voltage node controls current output of the current source circuit. The current supply circuit also includes a reference-setting circuit coupled to the reference voltage node and operable to establish a reference current level of the current source circuit, a common-emitter circuit coupled to the input node, and an emitter-follower circuit coupled to the input node, the emitter-follower circuit having an input coupled to an output of the common-emitter circuit and an output coupled to the reference voltage node.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: August 30, 2011
    Assignee: Gigoptix, Inc.
    Inventor: Vikas Manan
  • Publication number: 20100244956
    Abstract: A current control mechanism for use in low power consumption circuits with limited headroom includes a differential transistor pair from whose collectors a current output is taken. The current output is a function of a reference voltage provided at bases of a reference transistor pair having emitters that are coupled to the bases of the differential pair. The reference voltage is controlled by a pair of control transistors that control current through a load. A pair of tracking transistors can be provided to track supply voltage. A single-ended topology can also be implemented.
    Type: Application
    Filed: June 7, 2010
    Publication date: September 30, 2010
    Applicant: GigOptix, Inc.
    Inventor: Vikas Manan
  • Patent number: 7760781
    Abstract: A current control mechanism for use in low power consumption circuits with limited headroom includes a differential transistor pair from whose collectors a current output is taken. The current output is a function of a reference voltage provided at bases of a reference transistor pair having emitters that are coupled to the bases of the differential pair. The reference voltage is controlled by a pair of control transistors that control current through a load. A pair of tracking transistors can be provided to track supply voltage. A single-ended topology can also be implemented.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: July 20, 2010
    Assignee: Gigoptix, Inc.
    Inventor: Vikas Manan