Abstract: A method, apparatus, system, and computer program code for classifying data. A number of virtual datasets is generated at multiple granularities across a number of data dimensions. Data records that correspond to a combination of data dimensions are identified in a virtual dataset. A number of defined rules are applied to: determine a set of granularities for each of the number data dimensions for comparing the data records that were identified; and determine a model for comparing the data records that were identified. The data records are classified according to the model and the set of granularities that were determined for the number data dimensions.

Abstract: A cloud-based system and method for providing an interactive graphical user interface of a variable population set of applicants to a university for grant allocation are disclosed. The system receives student population data, target data, and historical data from one or more data sources. The received student population data, the historical data, and the target data are processed to create a master database, which includes a plurality of master database parameters. Subsequently, a plurality of scores for each applicant are determined based on various sets of the master database parameters. Based on the master database parameters and target data, threshold levels for grant allocation and success index are determined using a machine learning system. The threshold levels are dynamically changed using new target data to obtain a range of values for grant allocation. A simulation rendering the dynamic change of threshold levels is provided to the user.

Abstract: A method to provide ambient listening on target devices is shown. The ambience listening can be initiated by the listener or by the target device. When a console initiates an Ambience Listening (AL) call regarding a target and the target is logged into more than one device, the PTT server presents the console with a list of all concurrent devices of that user. The console is presented with additional information regarding the target, such as the location, role selected by the user on each device, and the user's operational status on each device. The operational status includes, for example, an emergency state. This enables the console to setup one or more ambience listening session with one or more appropriate devices.

Abstract: A method and apparatus for improved resource allocation in ad hoc group calls includes receiving a request for an ad hoc group call with another push-to-talk (PTT) system between a plurality of subscriber units comprising a plurality of Project 25 (P25) subscriber units; allocating resources with the another PTT system using an Inter Radio Frequency Subsystem Interface (ISSI) network to network interface (NNI); and identifying the ad hoc group call as a single logical call for the plurality of P25 subscriber units on the ISSI NNI. This can also include allocating a single channel for the plurality of P25 subscriber units identified as the single logical call.

Abstract: A communication system is provided that sets up a group call, originated in a first originating network, in a second originating network when insufficient resources are available in the first originating network, wherein the first originating network is one of a narrowband network and a broadband network and the second originating network is the other network of the narrowband and broadband networks. An infrastructure device of the first originating network receives a first group call request from an originating mobile device and, in response to receiving the request, determines that insufficient resources are available in the first originating network for allocation to the mobile device for the group call. In response to determining that insufficient network resources are available, the infrastructure device arranges to set up an originating leg of the group call for the originating mobile device in the second originating network.

Abstract: A method and apparatus for improved resource allocation in ad hoc group calls includes receiving a request for an ad hoc group call with another push-to-talk (PTT) system between a plurality of subscriber units comprising a plurality of Project 25 (P25) subscriber units; allocating resources with the another PTT system using an Inter Radio Frequency Subsystem Interface (ISSI) network to network interface (NNI); and identifying the ad hoc group call as a single logical call for the plurality of P25 subscriber units on the ISSI NNI. This can also include allocating a single channel for the plurality of P25 subscriber units identified as the single logical call.

Abstract: A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method includes receiving a request from a mobile station (102) to initiate a call session with a base station (104). After receiving the request, the base station determines that it cannot process the call session with the mobile station because the base station is fully loaded and sends a busy indication to the mobile station in response to determining that it cannot process the call session. The method can also include sending a scan response to the mobile station indicating a load for a neighboring base station (106) to the base station and handing over the mobile station to the neighboring base station.

Abstract: A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the semiconductor processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to modify the design and manufacture of integrated circuits.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.

Abstract: A method and system are described to reduce process variation as a result of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP), and chemical mechanical polishing (CMP) processing of films in integrated circuit manufacturing processes. The described methods use process variation and electrical impact to direct the insertion of dummy fill into an integrated circuit.