Patents by Inventor Vikas Rao
Vikas Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11939793Abstract: A safe including a lock actuator and a control system communicatively connected with the lock actuator, and a method for controlling a lock actuator of a safe are provided. The lock actuator is configured to lock or unlock a mechanical or electronic lock of the safe. The control system includes a transmitter, a receiver, and a processor. The transmitter is configured to emit light (ex. infrared light) into the safe. The receiver is configured to receive light, for example, the same infrared wave, emitted from the transmitter and generate an output signal. The processor is configured to receive the output signal from the receiver and determine whether item is inside the safe. The control system disables the lock actuator from locking the safe when the output signal indicates no item is inside the safe.Type: GrantFiled: January 8, 2021Date of Patent: March 26, 2024Inventors: Santhosh Amuduri, Srinivasa Rao Veeravalli, Subhash Reddy Gopavaram, Vikas Kumar
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Patent number: 11538731Abstract: Embodiments disclosed herein include electronic packages with improved thermal performance. In an embodiment, the electronic package comprises a first package substrate, a first die stack over the first package substrate, and a heat spreader over the first die stack. In an embodiment, the heat spreader comprises arms that extend out past sidewalls of the first package substrate. In an embodiment, the electronic package further comprises an interposer over and around the heat spreader, where the interposer is electrically coupled to the first package substrate by a plurality of interconnects. In an embodiment, the electronic package further comprises a second package substrate over the interposer, and a second die over the second package substrate.Type: GrantFiled: March 28, 2019Date of Patent: December 27, 2022Assignee: Intel CorporationInventors: Bijendra Singh, Vikas Rao, Sandesh Geejagaaru Krishnamurthy, Navneet Kumar Singh, Unnikrishnan Gopinanthan Pillai
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Patent number: 11340287Abstract: Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.Type: GrantFiled: July 25, 2018Date of Patent: May 24, 2022Assignee: Intel CorporationInventors: Ramaswamy Parthasarathy, Vikas Rao, Praveen Pai
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Publication number: 20220105513Abstract: An assay cartridge and an assay reader or other system for running an assay on the assay cartridge. The assay cartridge can be configured to perform different types of diagnostic assays, and the assay reader can be configured to run the specific assay for which the assay cartridge is configured, including PCR assays, immunoassays, and electrochemical bioassays. The assay cartridge can be inserted into the assay reader to run an assay. In some embodiments, the assay reader may have a user interface for configuring the assay reader and displaying results. In other embodiments, a phone or other device with a user interface and a diagnostic assay protocol application can communicate with the assay reader to provide the appropriate protocol instructions to run the assay, to collect and analyze data from the assay reader, and to report and store assay results.Type: ApplicationFiled: November 3, 2020Publication date: April 7, 2022Inventors: Krutarth Trivedi, Vikas Rao, Espir Kahatt, Kyle Elsabee, Kyle Bulloch
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Publication number: 20200312736Abstract: Embodiments disclosed herein include electronic packages with improved thermal performance. In an embodiment, the electronic package comprises a first package substrate, a first die stack over the first package substrate, and a heat spreader over the first die stack. In an embodiment, the heat spreader comprises arms that extend out past sidewalls of the first package substrate. In an embodiment, the electronic package further comprises an interposer over and around the heat spreader, where the interposer is electrically coupled to the first package substrate by a plurality of interconnects. In an embodiment, the electronic package further comprises a second package substrate over the interposer, and a second die over the second package substrate.Type: ApplicationFiled: March 28, 2019Publication date: October 1, 2020Inventors: Bijendra SINGH, Vikas RAO, Sandesh Geejagaaru KRISHNAMURTHY, Navneet Kumar SINGH, Unnikrishnan Gopinanthan PILLAI
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Patent number: 10656177Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.Type: GrantFiled: May 13, 2019Date of Patent: May 19, 2020Assignee: Intel CorporationInventors: Vikas Rao, Navneet K. Singh, Naveen G
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Publication number: 20200033401Abstract: Embodiments include a method of stress testing an electronics package with components that include a visual indicator. In an embodiment, the method comprises populating a plurality of components on an electronics package. In an embodiment, the plurality of components each comprise a visual indicator that is responsive to heat. In an embodiment, the method further comprises stress testing the electronics package and categorizing the plurality of components based on the visual indicators. In an embodiment, the method may further comprise modifying the plurality of components.Type: ApplicationFiled: July 25, 2018Publication date: January 30, 2020Inventors: Ramaswamy PARTHASARATHY, Vikas RAO, Praveen PAI
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Publication number: 20190271720Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.Type: ApplicationFiled: May 13, 2019Publication date: September 5, 2019Inventors: Vikas Rao, Navneet K. Singh, Naveen G
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Patent number: 10317428Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.Type: GrantFiled: November 2, 2016Date of Patent: June 11, 2019Assignee: Intel CorporationInventors: Vikas Rao, Navneet K. Singh, Naveen G
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Publication number: 20180120347Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.Type: ApplicationFiled: November 2, 2016Publication date: May 3, 2018Inventors: Vikas Rao, Navneet K. Singh, Naveen G
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Publication number: 20140065881Abstract: Embodiments of apparatus, methods, systems, devices, and connectors are described herein for a connector having a longitudinal body configured to mount the connector to a PCB. In various embodiments, a first and a second socket may be respectively disposed at a first side and a second side of the longitudinal body. In various embodiments, the first and second sockets may removably receive a first memory module from a first direction and a second memory module from a second direction opposite to the first direction. In various embodiments, the second side may be opposite to the first side. In various embodiments, on insertion into the first and second sockets, the first and second memory modules may be coplanar and/or equidistant from the PCB along a third direction orthogonal to the first and second directions.Type: ApplicationFiled: September 4, 2012Publication date: March 6, 2014Inventors: S. Vinay, Ramaswamy Parthasarathy, Shivaprasad Chandramouli, Shanto A. Thomas, Vikas Rao, Aruljothi Kandasamy