Patents by Inventor Vikas Sheth

Vikas Sheth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12473854
    Abstract: An exhaust structure for an exhaust manifold associated with an engine includes a first inlet section that defines a first inlet flow passage configured to receive exhaust gas, the first inlet flow passage defining a normalized cross-sectional area of flow, a second inlet section that defines a second inlet flow passage configured to receive exhaust gas, the second inlet flow passage defining the normalized cross-sectional area of flow, and an intermediate section disposed between the first inlet section and the second inlet section and in fluid communication with each of the first inlet section and the second inlet section, the intermediate section including: a flange and an exhaust redirection section having a reduced cross-sectional flow path measured at a midpoint along a length of the flange that is less than the normalized cross-sectional area of flow of the first inlet flow passage.
    Type: Grant
    Filed: March 12, 2024
    Date of Patent: November 18, 2025
    Assignee: Caterpillar Inc.
    Inventors: Vikas Sheth, Nataraj Srinivasan, Pradeep Venugopal, Parthiban Pechiyannan
  • Patent number: 12345188
    Abstract: An exhaust structure for an exhaust manifold includes a body including a first inlet section configured to receive exhaust gas, a second inlet section configured to receive exhaust gas, and an outlet section disposed in fluid communication with each of the first inlet section and the second inlet section to receive exhaust gas, wherein exhaust gas from the first inlet section and the second inlet section exit the exhaust structure through the outlet section, and wherein the outlet section includes a flange. The body may include a rib extending generally along the longitudinal axis and disposed on a surface of the outlet section, the rib including a first section having a first inclined surface, a second section spaced from the first section and having a second inclined surface, and a third section disposed between the first section and the second section, the third section having a curved surface.
    Type: Grant
    Filed: March 12, 2024
    Date of Patent: July 1, 2025
    Assignee: Caterpillar Inc.
    Inventors: Vikas Sheth, Nataraj Srinivasan
  • Publication number: 20240309793
    Abstract: An exhaust structure for an exhaust manifold includes a body including a first inlet section configured to receive exhaust gas, a second inlet section configured to receive exhaust gas, and an outlet section disposed in fluid communication with each of the first inlet section and the second inlet section to receive exhaust gas, wherein exhaust gas from the first inlet section and the second inlet section exit the exhaust structure through the outlet section, and wherein the outlet section includes a flange. The body may include a rib extending generally along the longitudinal axis and disposed on a surface of the outlet section, the rib including a first section having a first inclined surface, a second section spaced from the first section and having a second inclined surface, and a third section disposed between the first section and the second section, the third section having a curved surface.
    Type: Application
    Filed: March 12, 2024
    Publication date: September 19, 2024
    Applicant: Caterpillar Inc.
    Inventors: Vikas SHETH, Nataraj SRINIVASAN
  • Publication number: 20240309792
    Abstract: An exhaust structure for an exhaust manifold associated with an engine includes a first inlet section that defines a first inlet flow passage configured to receive exhaust gas, the first inlet flow passage defining a normalized cross-sectional area of flow, a second inlet section that defines a second inlet flow passage configured to receive exhaust gas, the second inlet flow passage defining the normalized cross-sectional area of flow, and an intermediate section disposed between the first inlet section and the second inlet section and in fluid communication with each of the first inlet section and the second inlet section, the intermediate section including: a flange and an exhaust redirection section having a reduced cross-sectional flow path measured at a midpoint along a length of the flange that is less than the normalized cross-sectional area of flow of the first inlet flow passage.
    Type: Application
    Filed: March 12, 2024
    Publication date: September 19, 2024
    Applicant: Caterpillar Inc.
    Inventors: Vikas SHETH, Nataraj SRINIVASAN, Pradeep VENUGOPAL, Parthiban PECHIYANNAN
  • Publication number: 20120318371
    Abstract: A gas handling transport assembly includes a bellows assembly together with a bellows engaging structure. The bellows engaging structure includes an engaging surface that engages an outer surface of the bellows assembly to restrain movement thereof. An open first end and an open second end may be provided along a longitudinal axis of the bellows assembly. A method of using the assembly is also provided.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 20, 2012
    Applicant: CATERPILLAR INC.
    Inventors: C. Joseph Rynders, JR., Arthur Scott Lindell, Vikas Sheth, Bradley L. Fix, Kipp D. Edwards, Steven F. Meister, Gabriel Stefan, Srikanth Tummala
  • Publication number: 20070207404
    Abstract: A method for reducing line edge roughness (LER) in a layer of photoresist is provided. In accordance with the method, a layer of photoresist is applied to a substrate. The layer of photoresist is then patterned and annealed in an atmosphere comprising at least one gas selected from the group consisting of hydrogen, nitrogen and fluorine-containing materials. Preferably, the anneal is performed after patterning the photoresist, but either immediately after, or subsequent to, the trim.
    Type: Application
    Filed: March 6, 2006
    Publication date: September 6, 2007
    Inventors: Jinmiao Shen, Jonathan Cobb, William Darlington, Brian Fisher, Mark Hall, Vikas Sheth, Mehul Shroff, James Vasek
  • Publication number: 20060105568
    Abstract: A method for forming a semiconductor device (10) includes forming an organic anti-reflective coating (OARC) layer (18) over the semiconductor device (10). A tetra-ethyl-ortho-silicate (TEOS) layer (20) is formed over the OARC layer (18). The TEOS layer (20) is exposed to oxygen-based plasma at a temperature of at most about 300 degrees Celsius. In an alternative embodiment, the TEOS layer (20) is first exposed to a nitrogen-based plasma before being exposed to the oxygen-based plasma. A photoresist layer (22) is formed over the TEOS layer (20) and patterned. By applying oxygen based plasma and nitrogen based plasma to the TEOS layer (20) before applying photoresist, pattern defects are reduced.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Inventors: Jin Shen, Brian Fisher, Mark Hall, Kurt Junker, Vikas Sheth, Mehul Shroff