Patents by Inventor Vikki L. Johnson

Vikki L. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder compositions
    Patent number: 10661393
    Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 26, 2020
    Assignee: Honeywell International Inc.
    Inventors: Jianxing Li, Michael R. Pinter, Vikki L. Johnson
  • LEAD-FREE SOLDER COMPOSITIONS
    Publication number: 20180339369
    Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
    Type: Application
    Filed: July 13, 2018
    Publication date: November 29, 2018
    Inventors: Jianxing LI, Michael R. Pinter, Vikki L. Johnson
  • Lead-free solder compositions
    Patent number: 10046417
    Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 14, 2018
    Assignee: Honeywell International Inc.
    Inventors: Jianxing Li, Michael R. Pinter, Vikki L. Johnson
  • LEAD-FREE SOLDER COMPOSITIONS
    Publication number: 20170008131
    Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
    Type: Application
    Filed: February 20, 2014
    Publication date: January 12, 2017
    Inventors: Jianxing Li, Michael R. Pinter, Vikki L. Johnson