Abstract: Sets of power amplifier branches (which comprise an RF/microwave amplifier stage) are power combined within each stage and each set of power amplifier branches are biased in different classes of operation by bias circuits possessing different impedance characteristics such that the fundamental frequency components present at the output are in-phase with one another and the IMD3 components are anti-phase over a broad range of power levels. The RF input signal is provided by the output of the previous stage of the RF/microwave amplifier. The output of each stage is formed by power combining sets of these power amplifier branches, each of which are separately biased, so the fundamental components are additive resulting in the maximum possible output power and the IM3 components cancel partially or completely.

Abstract: Sets of power amplifier branches (which comprise an RF/microwave amplifier stage) are power combined within each stage and each set of power amplifier branches are biased in different classes of operation by bias circuits possessing different impedance characteristics such that the fundamental frequency components present at the output are in-phase with one another and the IMD3 components are anti-phase over a broad range of power levels. The RF input signal is provided by the output of the previous stage of the RF/microwave amplifier. The output of each stage is formed by power combining sets of these power amplifier branches, each of which are separately biased, so the fundamental components are additive resulting in the maximum possible output power and the IM3 components cancel partially or completely.

Abstract: A light emitting device containing an array of directional emission LEDs is provided. The directional emission LEDs of the array may be substrate emitting, lateral current injection, resonant cavity LEDs mounted in a flip-chip configuration. Each LED may emit a different color of light, such that the output of the array appears white to an observer. The LED array package may contain microoptical elements, such as a diffraction grating or microprisms, integrated into the light emitting surface of the package. The microoptical elements are used to mix the light beams emitted by individual LEDs in the array.

Abstract: A time-domain communication system in an ultrasonic imaging system includes an ultrasonic probe having an ultrasonic array with ultrasonic array outputs and a time-domain multiplexer with an input connected to each of the ultrasonic array outputs and also having a multiplexer output. The time-domain multiplexer continually cycles through each of the ultrasonic array outputs at a predetermined frequency connecting each of the ultrasonic array outputs to the multiplexer output for a predetermined amount of time. An ultrasonic data processing unit is provided and includes a de-multiplexer connected to the multiplexer output. The de-multiplexer has de-multiplexer outputs and continually cycles through each of the de-multiplexer outputs at the predetermined frequency connecting each of the de-multiplexer outputs to the multiplexer output for the predetermined amount of time.

Abstract: A light emitting device containing an array of directional emission LEDs is provided. The directional emission LEDs of the array may be substrate emitting, lateral current injection, resonant cavity LEDs mounted in a flip-chip configuration. Each LED may emit a different color of light, such that the output of the array appears white to an observer. The LED array package may contain microoptical elements, such as a diffraction grating or microprisms, integrated into the light emitting surface of the package. The microoptical elements are used to mix the light beams emitted by individual LEDs in the array.

Abstract: A time-domain communication system in an ultrasonic imaging system includes an ultrasonic probe having an ultrasonic array with ultrasonic array outputs and a time-domain multiplexer with an input connected to each of the ultrasonic array outputs and also having a multiplexer output. The time-domain multiplexer continually cycles through each of the ultrasonic array outputs at a predetermined frequency connecting each of the ultrasonic array outputs to the multiplexer output for a predetermined amount of time. An ultrasonic data processing unit is provided and includes a de-multiplexer connected to the multiplexer output. The de-multiplexer has de-multiplexer outputs and continually cycles through each of the de-multiplexer outputs at the predetermined frequency connecting each of the de-multiplexer outputs to the multiplexer output for the predetermined amount of time.

Abstract: A depletion mode MOSFET and resistor are fabricated as a silicon carbide (SiC) integrated circuit (IC). The SiC IC includes a first SiC layer doped to a first conductivity type and a second SiC layer overlaid on the first SiC layer and doped to a second conductivity type. The second SiC layer includes at least four more heavily doped regions of the second conductivity type, with two of such regions comprising MOSFET source and drain electrodes and two other of such regions comprising resistor electrodes. The second SiC layer includes an isolation trench between the MOSFET electrodes and the resistor electrodes. At least two electrically conductive contacts are provided as MOSFET electrode contacts, each being positioned over at least a portion of a respective MOSFET electrode and two other electrically conductive contacts are provided as resistor electrode contacts, each being positioned over at least a portion of a respective resistor electrode.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.