Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Address decoders and access line drivers are provided. One such row decoder and access line driver receives power supply voltages in a manner that prevents CHC damage and avoids GIDL currents in transistors in the decoder and driver. The row decoder and a latch in the driver are powered by a first supply voltage, and an output stage in the access line driver is powered by a second supply voltage. The first and second supply voltages are maintained at a relatively low level during standby before an address is decoded. Only after an address is decoded to set the latch are the supply voltages increased to levels needed to drive the access line. Further, before resetting the latch, the first and power supply voltages are decreased to their standby levels. By maintaining the first and second voltages relatively low until after the latch is set and reset, GIDL currents may be avoided and CHC damage may be prevented.

Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Address decoders and access line drivers are provided. One such row decoder and access line driver receives power supply voltages in a manner that prevents CHC damage and avoids GIDL currents in transistors in the decoder and driver. The row decoder and a latch in the driver are powered by a first supply voltage, and an output stage in the access line driver is powered by a second supply voltage. The first and second supply voltages are maintained at a relatively low level during standby before an address is decoded. Only after an address is decoded to set the latch are the supply voltages increased to levels needed to drive the access line. Further, before resetting the latch, the first and power supply voltages are decreased to their standby levels. By maintaining the first and second voltages relatively low until after the latch is set and reset, GIDL currents may be avoided and CHC damage may be prevented.

Abstract: A row decoder and access line driver receives power supply voltages in a manner that prevents CHC damage and avoids GIDL currents in transistors in the decoder and driver. The row decoder and a latch in the driver are powered by a first supply voltage, and an output stage in the access line driver is powered by a second supply voltage. The first and second supply voltages are maintained at a relatively low level during standby before an address is decoded. Only after an address is decoded to set the latch are the supply voltages increased to levels needed to drive the access line. Further, before resetting the latch, the first and power supply voltages are decreased to their standby levels. By maintaining the first and second voltages relatively low until after the latch is set and reset, GIDL currents may be avoided and CHC damage may be prevented.

Abstract: Apparatus and methods are disclosed, such as those involving a memory device. One such memory device includes a memory array including a sub-array that includes a first number of columns of memory cells, and one or more global input/output (I/O) lines shared by the first number of columns for data transmission. The memory device also includes one or more multiplexers/demultiplexers, wherein each of the multiplexers/demultiplexers is electrically coupled to one or more, but not all, of the global I/O lines. The memory device further includes a plurality of local I/O lines, each configured to provide a data path between one of the multiplexers/demultiplexers and one or more, but less than the first number, of the columns in the sub-array. This configuration allows local I/O line repairability with fewer redundant elements, and shorter physical local I/O lines, which translate to improved speed and die size reduction.

Abstract: Address decoders and access line drivers are provided. One such row decoder and access line driver receives power supply voltages in a manner that prevents CHC damage and avoids GIDL currents in transistors in the decoder and driver. The row decoder and a latch in the driver are powered by a first supply voltage, and an output stage in the access line driver is powered by a second supply voltage. The first and second supply voltages are maintained at a relatively low level during standby before an address is decoded. Only after an address is decoded to set the latch are the supply voltages increased to levels needed to drive the access line. Further, before resetting the latch, the first and power supply voltages are decreased to their standby levels. By maintaining the first and second voltages relatively low until after the latch is set and reset, GIDL currents may be avoided and CHC damage may be prevented.

Abstract: An apparatus and method using a reduced number of fuses for enabling redundant memory blocks in a semiconductor memory is disclosed. In one embodiment, a redundancy selection module may be configured using selection fuses, wherein each selection fuse selects a pair of repair modules. In another embodiment, a redundancy selection module may be configured using selection fuses, wherein each selection fuse may select a power of two (i.e., 1, 2, 4, 8, etc.) number of repair modules. Each repair module includes fuses programmed with a selected address, such that the repair module may respond when an address input matches the selected address. However, the Least Significant Bit (LSB) is uninvolved in the address programming. Instead, the LSB is compared to the values of the selection fuses. As a result, repair modules select a redundant memory block based on a combination of the selected address comparison and the separate LSB comparison.

Abstract: An apparatus and method using a reduced number of fuses for enabling redundant memory blocks in a semiconductor memory is disclosed. In one embodiment, a redundancy selection module may be configured using selection fuses, wherein each selection fuse selects a pair of repair modules. In another embodiment, a redundancy selection module may be configured using selection fuses, wherein each selection fuse may select a power of two (i.e., 1, 2, 4, 8, etc.) number of repair modules. Each repair module includes fuses programmed with a selected address, such that the repair module may respond when an address input matches the selected address. However, the Least Significant Bit (LSB) is uninvolved in the address programming. Instead, the LSB is compared to the values of the selection fuses. As a result, repair modules select a redundant memory block based on a combination of the selected address comparison and the separate LSB comparison.