Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.

Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.

Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.

Abstract: A light scattering photometer signal-enhancement systems includes an adaptive sample and subtract circuit controlled by a computer or microcontroller (MCU). The MCU controls the gain of a programmable-gain amplifier (PGA) cascade that is used to amplify the raw photometer signal. In order to maintain the DC accuracy, the DC offset contained in the raw signal from the photometer is estimated by an algorithmic within the MCU and then subtracted from the raw signal before allowing it to be amplified by the PGA cascade. In addition to DC estimation and adaptive cancellation, the MCU applies a digital filtering scheme to compensate irrelevant frequency bands in the amplified signal and offers user determined averaging functions for additional signal conditioning. Moreover, hardware filters are used to prevent signal aliasing by the analog to digital converters (ADC) and a 60 Hz notch filter suppresses general electrical noise.