Patents by Inventor Vikram Venkatadri

Vikram Venkatadri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190273280
    Abstract: A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 5, 2019
    Inventors: Kelvin Po Leung Pun, Vikram Venkatadri, David Frank Bolognia, Chee Wah Cheung
  • Publication number: 20190232021
    Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 1, 2019
    Inventors: Vikram Venkatadri, David Frank Bolognia
  • Patent number: 10340302
    Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: July 2, 2019
    Assignee: Analog Devices, Inc.
    Inventors: David Frank Bolognia, Vikram Venkatadri
  • Publication number: 20190139695
    Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding.
    Type: Application
    Filed: October 17, 2018
    Publication date: May 9, 2019
    Inventors: Vikram Venkatadri, David Frank Bolognia, Kelvin Po Leung Pun, Chee Wah Cheung
  • Publication number: 20190043823
    Abstract: In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.
    Type: Application
    Filed: June 25, 2018
    Publication date: February 7, 2019
    Inventors: Vikram Venkatadri, David Frank Bolognia
  • Patent number: 10090094
    Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: October 2, 2018
    Assignee: Analog Devices, Inc.
    Inventors: David Bolognia, Vikram Venkatadri
  • Patent number: 10074624
    Abstract: Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: September 11, 2018
    Assignee: Analog Devices, Inc.
    Inventor: Vikram Venkatadri
  • Publication number: 20180062071
    Abstract: An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.
    Type: Application
    Filed: August 21, 2017
    Publication date: March 1, 2018
    Inventors: David Frank Bolognia, Christopher W. Hyde, Jochen Schmitt, Vikram Venkatadri
  • Publication number: 20170352469
    Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.
    Type: Application
    Filed: June 6, 2016
    Publication date: December 7, 2017
    Inventors: David Bolognia, Vikram Venkatadri
  • Patent number: 9769562
    Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: September 19, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Vikram Venkatadri, David Bolognia
  • Publication number: 20170040275
    Abstract: Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 9, 2017
    Inventor: Vikram Venkatadri
  • Publication number: 20170025463
    Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.
    Type: Application
    Filed: July 22, 2015
    Publication date: January 26, 2017
    Inventors: David Frank Bolognia, Vikram Venkatadri
  • Publication number: 20160088389
    Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.
    Type: Application
    Filed: December 2, 2015
    Publication date: March 24, 2016
    Inventors: Aleksey S. Khenkin, Vikram Venkatadri, David Bolognia
  • Patent number: 9254995
    Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: February 9, 2016
    Assignee: Analog Devices, Inc.
    Inventors: David Bolognia, Vikram Venkatadri
  • Patent number: 9226052
    Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: December 29, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Aleksey S. Khenkin, Vikram Venkatadri, David Bolognia
  • Publication number: 20150076628
    Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Applicant: Analog Devices, Inc.
    Inventors: David Bolognia, Vikram Venkatadri
  • Publication number: 20140205127
    Abstract: A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Applicant: Invensense, Inc.
    Inventors: Aleksey S. Khenkin, Vikram Venkatadri, David Bolognia