Abstract: It is the object of the present invention to provide a low weight, compact, low vertical profile thermal management system for removing heat from electronic components. The thermal management system comprises of a plurality of “flow-through” type cooling devices, a source of filtered pressurized fluid suitable for use as a coolant, and a fluid delivering device that supplies the cooling devices with fluid. A preferred fluid is air, such as a filtered pressurized air. The cooling device is comprised of a high conductivity metal matrix composite heat spreader, a miniature heat sink, preferably of the same material, a permeable heat exchanger with high specific surface, and a closure that provides structural integrity of the cooling device.

Abstract: A thermally regulated injection mold in which the tooling layer is a relatively thin layer supported by a rib structure disposed on the rear surface. The temperature of the mold is controlled by impinging the rear surface of the tooling layer with a heated fluid medium or a fluid cooling medium.

Abstract: The present invention broadly relates to the mechanical locking and constrainment of an active layer on a given solid surface, wherein the active layer is formed. In addition, disclosed herein is a macrostructured mold with improved heat-absorbing ability comprising a solid base and an active layer disposed on the solid base, wherein the active layer comprises a metal matrix composite formed by the process of infiltrating a powdered preform with a molten infiltrating alloy at an infiltrating temperature, wherein the solid base is formed from material with a melt temperature higher then said infiltration temperature. The solid base further contains one or a plurality of preformed grooves for circulation of cooling fluid, wherein the active layer seals the grooves in the solid base wherein the sealed grooves are designed to contain the cooling fluid thereby providing a mold with improved heat-absorbing ability.

Abstract: The present invention broadly relates to the mechanical locking and constrainment of an active layer on a given solid surface, wherein the active layer is formed. In addition, disclosed herein is a macrostructured mold with improved heat-absorbing ability comprising a solid base and an active layer disposed on the solid base, wherein the active layer comprises a metal matrix composite formed by the process of infiltrating a powdered preform with a molten infiltrating alloy at an infiltrating temperature, wherein the solid base is formed from material with a melt temperature higher than the infiltration temperature. The solid base further contains one or a plurality of preformed grooves for circulation of cooling fluid, wherein the active layer seals the grooves in the solid base wherein the sealed grooves are designed to contain the cooling fluid thereby providing a mold with improved heat-absorbing ability.

Abstract: The present invention broadly relates to the mechanical locking and constrainment of an active layer on a given solid surface, wherein the active layer is formed. In addition, disclosed herein is a macrostructured mold with improved heat-absorbing ability comprising a solid base and an active layer disposed on the solid base, wherein the active layer comprises a metal matrix composite formed by the process of infiltrating a powdered preform with a molten infiltrating alloy at an infiltrating temperature, wherein the solid base is formed from material with a melt temperature higher than the infiltration temperature. The solid base further contains one or a plurality of preformed grooves for circulation of cooling fluid, wherein the active layer seals the grooves in the solid base wherein the sealed grooves are designed to contain the cooling fluid thereby providing a mold with improved heat-absorbing ability.