Patents by Inventor Viktor Goldovsky

Viktor Goldovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEEP ULTRAVIOLET AND INFRARED SILICON SENSOR MODULE
    Publication number: 20230006075
    Abstract: A sensor module that may include optics and a sensor located downstream to the optics. The optics may include a self-assembling polymer and luminescent elements embedded in the self-assembling polymer.
    Type: Application
    Filed: July 4, 2021
    Publication date: January 5, 2023
    Applicant: HILLBERRY GAT LTD.
    Inventors: Viktor Goldovsky, Yonohan Davidovich, David Avner
  • Deep ultraviolet and infrared silicon sensor module
    Patent number: 11538946
    Abstract: A sensor module that may include optics and a sensor located downstream to the optics. The optics may include a self-assembling polymer and luminescent elements embedded in the self-assembling polymer.
    Type: Grant
    Filed: July 4, 2021
    Date of Patent: December 27, 2022
    Assignee: HILLBERRY GAT LTD.
    Inventors: Viktor Goldovsky, Yonohan Davidovich, David Avner
  • Image sensor module and a method for evaluating an image sensor
    Patent number: 10210526
    Abstract: An image sensor module that comprises a die, wherein the die comprises light sensors and optics; and wherein the optics comprises luminescent elements that represent die manufacturing information that is indicative of a manufacturing process of the die.
    Type: Grant
    Filed: April 19, 2015
    Date of Patent: February 19, 2019
    Assignees: TOWER SEMICONDUCTOR LTD., HILLBERRY GAT LTD.
    Inventors: Yakov Roizin, Viktor Goldovsky, Avi Strum, Yohanan Davidovich, Amos Fenigstein, Assaf Lahav, David Avner
  • IMAGE SENSOR MODULE AND A METHOD FOR EVALUATING AN IMAGE SENSOR
    Publication number: 20160307203
    Abstract: An image sensor module that comprises a die, wherein the die comprises light sensors and optics; and wherein the optics comprises luminescent elements that represent die manufacturing information that is indicative of a manufacturing process of the die.
    Type: Application
    Filed: April 19, 2015
    Publication date: October 20, 2016
    Inventors: Yakov Roizin, Viktor Goldovsky, Avi Strum, Yohanan Davidovich, Amos Fenigstein, Assaf Lahav, David Avner