Patents by Inventor Viktor Heitzler

Viktor Heitzler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component with a leadframe
    Patent number: 9620391
    Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: April 11, 2017
    Assignee: Micronas GmbH
    Inventors: Wolfgang Hauser, Viktor Heitzler, Christian Joos
  • ELECTRONIC COMPONENT WITH A LEADFRAME
    Publication number: 20160035594
    Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.
    Type: Application
    Filed: October 9, 2015
    Publication date: February 4, 2016
    Applicant: MICRONAS GMBH
    Inventors: Wolfgang HAUSER, Viktor HEITZLER, Christian JOOS
  • An electronic component with a leadframe
    Publication number: 20040113240
    Abstract: The invention relates to an electronic component (1) including a leadframe (2), composed of a platform (5), and possibly at least one electrical connecting piece (6′, 6″), wherein at least one electronic member (3) is located on the platform (5), and including a housing (4) that encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided to support the platform (5) during the fabrication process for the housing (4), and wherein at least a section of the at least one support region (7) projects from the housing (4).
    Type: Application
    Filed: October 14, 2003
    Publication date: June 17, 2004
    Inventors: Wolfgang Hauser, Viktor Heitzler, Christian Joos
  • Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility
    Patent number: 5083193
    Abstract: To further reduce the manufacturing costs of semiconductor devices, such as TO-92 transistors or thyristors, a prefabricated plastic can or housing is filled with cast resin, and the chip, together with its leads and a synthetic-resin cover, is inserted into the cast resin and the can, with portions of the leads engaging a groove in the can. The apparatus for inserting the chips, etc., into the cans includes a feed rail for the cans, a centering slide, and a swivelling gripper onto which the cans are pushed by the centering slide. When rotated, the swivelling gripper slips the cans over the chips mounted on a lead frame moving above the swivelling gripper.
    Type: Grant
    Filed: August 4, 1989
    Date of Patent: January 21, 1992
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Viktor Heitzler, Richard Kapp