Abstract: A multilayered switching structure is disclosed for the development and the production of an apparatus based on microelectronic components and semiconductor devices. The structure may widely be used in the production of multilayered printed circuit cards and switching structures for monocrystalline modules. The multilayered switching structure includes a plurality of layers of a dielectric material which include electroconductive tracks on their surfaces and which consist of switching layers. This structure also includes contact nodes consisting of metallized contacts which are aligned with each other and which are electrically and mechanically connected together by an electroconductive binding material. The contact nodes are made in the form of splices arranged between the contacts. In a second embodiment, the multilayered switching plate includes electroconductive tracks provided on both sides of each switching layer and are connected together within the limits of each layer by metallized junction openings.

Abstract: An IC chip carrier has a base formed from a film of dielectric material and a system of oriented and fixed conducting paths on a top surface of the base. A first group of the conducting paths is configured to mate directly with chip contact pads and a second group of the conducting paths is configured to mate with mating contacts on a circuit board. The IC chip carrier includes further a plurality of contacts for selectively connecting to the mating chip contact pads and the mating contacts on the circuit board. All contacts are formed as metallized vias having top edges coupled to the conducting paths on the top surface of the base, wherein bottom edges of the vias form contact assemblies with the mating contact pads of the chip or with mating contact pads of the circuit board.