Patents by Inventor Vilas N. Koinkar

Vilas N. Koinkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for break-in and conditioning a fixed abrasive polishing pad
    Publication number: 20020173235
    Abstract: The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.
    Type: Application
    Filed: March 29, 2002
    Publication date: November 21, 2002
    Inventors: Vilas N. Koinkar, Reza Golzarian, Matthew VanHanehem, Qiuliang Luo, James Shen, Peter A. Burke
  • Methods for break-in and conditioning a fixed abrasive polishing pad
    Patent number: 6419553
    Abstract: The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: July 16, 2002
    Assignee: Rodel Holdings, Inc.
    Inventors: Vilas N. Koinkar, Reza Golzarian, Matthew VanHanehem, Qiuliang Luo, James Shen, Peter A. Burke
  • Control of removal rates in CMP
    Publication number: 20020019202
    Abstract: A two-step method for chemical mechanical polishing of a semiconductor substrate having successive layers, comprised of, a metal layer, an underlying barrier film and an underlying dielectric layer. The first polishing step is performed utilizing a slurry composition selective to the metal in the metal layer, to remove the metal at a high removal rate during polishing, and the second polishing step is performed utilizing a slurry composition selective to the barrier film and least selective to the metal layer and the underlying dielectric layer. In an alternate embodiment, the second polishing step is performed with a slurry equally selective to the barrier layer and the underlying dielectric layer and least selective to the metal of the metal layer, to remove the barrier layer at a high removal rate during polishing, and level a surface of the dielectric layer to the surface of the metal interconnection structure in the underlying dielectric layer.
    Type: Application
    Filed: February 28, 2001
    Publication date: February 14, 2002
    Inventors: Terence M. Thomas, Qianqiu (Christine) Ye, Joseph K. So, Peter A. Burke, Vikas Sachan, Elizabeth A. Langlois, Keith G. Pierce, Craig D. Lack, David Gettman, Hiroyuki Senoo, Kouchi Yoshida, Yoshikazu Nishida, Vilas N. Koinkar, Raymond Lee Lavoie
  • Methods for break-in and conditioning a fixed abrasive polishing pad
    Publication number: 20010053660
    Abstract: The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP).
    Type: Application
    Filed: January 4, 2001
    Publication date: December 20, 2001
    Inventors: Vilas N. Koinkar, Reza Golzarian, Matthew VanHanehem, Qiuliang Luo, James Shen, Peter A. Burke
  • Polishing pad surface on hollow posts
    Publication number: 20010039175
    Abstract: A polishing pad comprising: a base from which extends multiple posts having top surfaces that collectively provide a polishing surface on the polishing pad, and each of the top surfaces being recessed with an opening to provide a second cutting edge on the post, and the opening providing a reservoir for polishing fluid.
    Type: Application
    Filed: February 28, 2001
    Publication date: November 8, 2001
    Inventors: Reza Golzarian, Vilas N. Koinkar