Patents by Inventor Vilhelm Lindman

Vilhelm Lindman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080191174
    Abstract: The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.
    Type: Application
    Filed: June 22, 2006
    Publication date: August 14, 2008
    Applicant: Cypak AB
    Inventors: Jakob Ehrensvard, Leif Henrik Eriksson, Vilhelm Lindman