Patents by Inventor Vili LÄMSÄ

Vili LÄMSÄ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11251214
    Abstract: According to an embodiment, a device comprises a direct conversion compound semiconductor layer configured to convert high energy radiation photons into an electric current, the direct conversion compound semiconductor layer comprising: a pixel array positioned in the direct conversion compound semiconductor layer, including pixels located at an outermost circumference, wherein the pixels comprise signal pads; a guard ring encircling the pixel array, wherein the pixels at the outermost circumference are closest to the guard ring; guard ring contact pads, wherein the guard ring contact pads are situated in place of some of the pixel signal pads at the outermost circumference and connected to the guard ring; wherein the guard ring contact pads are further situated asymmetrically with respect to a symmetry x-axis and a symmetry y-axis of the direct conversion compound semiconductor layer.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 15, 2022
    Assignee: DETECTION TECHNOLOGY OY
    Inventor: Vili Lämsä
  • Publication number: 20190386055
    Abstract: According to an embodiment, a device comprises a direct conversion compound semiconductor layer configured to convert high energy radiation photons into an electric current, the direct conversion compound semiconductor layer comprising: a pixel array positioned in the direct conversion compound semiconductor layer, including pixels located at an outermost circumference, wherein the pixels comprise signal pads; a guard ring encircling the pixel array, wherein the pixels at the outermost circumference are closest to the guard ring; guard ring contact pads, wherein the guard ring contact pads are situated in place of some of the pixel signal pads at the outermost circumference and connected to the guard ring; wherein the guard ring contact pads are further situated asymmetrically with respect to a symmetry x-axis and a symmetry y-axis of the direct conversion compound semiconductor layer.
    Type: Application
    Filed: January 25, 2018
    Publication date: December 19, 2019
    Inventor: Vili LÄMSÄ