Patents by Inventor Ville S. Kiiskinen

Ville S. Kiiskinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dry etch process to edit copper lines
    Patent number: 6900137
    Abstract: The present invention is directed to methods for editing copper features embedded within an organic body by exposing at least a portion of a top surface of the copper feature, forming a mill box there-over and then simultaneously milling both the copper feature and any organic material exposed through the mill box in a single step using an ion beam in combination with a XeF2 gas for a dwell time of at least 10 milliseconds. The invention dramatically increases the efficiency of Focused Ion Beam milling of copper features embedded in organic layers by milling these features in a gas-depleted environment at significantly increased dwell time while avoiding the problems of graphitization, destruction of the organic layer and metal redeposition.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: May 31, 2005
    Assignee: International Business Machines Corporation
    Inventors: Steven B. Herschbein, Ville S. Kiiskinen, Chad Rue, Carmelo F. Scrudato, Michael R. Sievers
  • DRY ETCH PROCESS TO EDIT COPPER LINES
    Publication number: 20040188380
    Abstract: The present invention is directed to methods for editing copper features embedded within an organic body by exposing at least a portion of a top surface of the copper feature, forming a mill box there-over and then simultaneously milling both the copper feature and any organic material exposed through the mill box in a single step using an ion beam in combination with a XeF2 gas for a dwell time of at least 10 milliseconds. The invention dramatically increases the efficiency of Focused Ion Beam milling of copper features embedded in organic layers by milling these features in a gas-depleted environment at significantly increased dwell time while avoiding the problems of graphitization, destruction of the organic layer and metal redeposition.
    Type: Application
    Filed: March 28, 2003
    Publication date: September 30, 2004
    Applicant: International Business Machines Corporation
    Inventors: Steven B. Herschbein, Ville S. Kiiskinen, Chad Rue, Carmelo F. Scrudato, Michael R. Sievers