Abstract: In some aspects, a method is provided for mapping contents of a substrate carrier. The method includes (1) moving a carrier to a sensor; and (2) determining, with the sensor, a presence or an absence of a substrate in the carrier based upon a position of a substrate clamp in the carrier. Numerous other aspects are provided.

Abstract: Embodiments of the present invention provide an end effector for a substrate handling robot. In one embodiment, the end effector comprises one or more Bernoulli chucks surrounded by a plurality of suction cup devices. In one embodiment, the suction cup devices are configured in the form of a bellows to provide both cushioning and lateral stability to the substrate. In one embodiment, the suction cup devices further include an air pressure device to provide light positive pressure to the substrate during release. Embodiments of the end effector described herein provide a small vacuum pressure over a large area of ultra-thin substrates to minimize damage during handling.

Abstract: A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table.

Abstract: The present invention generally provides an apparatus and a method for automatically calibrating the placement of fragile substrates into a substrate carrier. Embodiments of the present invention also provide an apparatus and a method for inspecting the fragile substrates prior to processing to prevent damaged substrates from being further processed or broken in subsequent transferring steps. Embodiments of the invention also generally provide an apparatus and a method for determining the alignment and orientation substrates that are to be delivered into or removed from a substrate carrier. Embodiments of the invention further provide an apparatus and method for accurately positioning the substrate carrier for substrate loading. The substrate carriers are generally used to support a batch of substrates that are to be processed in a batch processing chamber.

Abstract: Systems, apparatus and methods for the rapid exchange of work material in a facility processing substrates (e.g., LCD panels, solar panels, semiconductor wafers, or the like) are disclosed. The system may include load ports associated with a process tool, local storage units, and a work material exchange apparatus adapted to rapidly exchange work material at the ports, units, or other exchange locations. The work material exchange apparatus may include two or more end effectors coupled to one or more actuator members and which may be adapted to rapidly exchange two or more carriers containing work material at an exchange location.

Abstract: Aspects of the invention include a method and apparatus for processing a substrate using a multi-chamber processing system (e.g., a cluster tool) adapted to process substrates in one or more batch and/or single substrate processing chambers to increase the system throughput. In one embodiment, a system is configured to perform a substrate processing sequence that contains batch processing chambers only, or batch and single substrate processing chambers, to optimize throughput and minimize processing defects due to exposure to a contaminating environment. In one embodiment, a batch processing chamber is used to increase the system throughput by performing a process recipe step that is disproportionately long compared to other process recipe steps in the substrate processing sequence that are performed on the cluster tool. In another embodiment, two or more batch chambers are used to process multiple substrates using one or more of the disproportionately long processing steps in a processing sequence.

Abstract: The present invention generally provides a batch substrate processing system, or cluster tool, for in-situ processing of a film stack used to form regions of a solar cell device. In one configuration, the film stack formed on each of the substrates in the batch contains one or more silicon-containing layers and one or more metal layers that are deposited and further processed within the various chambers contained in the substrate processing system.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered.

Abstract: Methods and systems are provided for mapping substrates in a substrate carrier. The invention includes a substrate carrier including one or more windows; and an imaging system coupled to a substrate carrier handling robot and adapted to determine or image substrate positions in the substrate carrier via the one or more windows. Numerous other aspects are provided.

Abstract: Methods and systems are provided. The invention includes performing a handshake directly between a load port associated with process equipment and material handling equipment; and transferring a carrier between the material handling equipment and the load port based on the handshake. Numerous other aspects are provided.

Abstract: Systems, methods, and apparatus are provided for electronic device manufacturing. The invention includes removing a first substrate carrier and a second substrate carrier from a moving conveyor using an end effector assembly and concurrently transferring the first and second substrate carriers from the moving conveyor to a support location via the end effector assembly. Numerous other aspects are provided.

Abstract: A conveyor apparatus adapted to transport and article is provided. The conveyor apparatus has a belt section including a plurality of slots and a plurality of T-shaped stiffeners extending in the slots. Respective belt sections may be spliced together using a plurality of T-shaped stiffeners extending through slots in diagonally-formed ends of each belt section. Methods of the invention are described as are numerous other aspects.

Abstract: In some embodiments, a method of processing substrates is provided that includes (1) grouping substrates in a plurality of substrate carriers as a logical lot; (2) processing the logical lot as if the substrates were stored in a single substrate carrier; and (3) performing metrology on a representative subset of substrates in the logical lot. Numerous other embodiments are provided.

Abstract: A substrate handling apparatus and method include a small lot loadport configuration having a plurality of small lot loadports adapted to be coupled to an equipment front end module (EFEM) designed for use with a large lot substrate carrier and having a large lot loadport envelope, where the small lot loadport configuration has a combined envelope substantially similar to the large lot loadport envelope, and where each small lot loadport is adapted to dock with a small lot substrate carrier. A system also is provided that includes (1) the (EFEM) and (2) the small lot loadport configuration. Numerous other aspects are provided.

Abstract: In some aspects, a method is provided for mapping contents of a substrate carrier. The method includes (1) moving a carrier to a sensor; and (2) determining, with the sensor, a presence or an absence of a substrate in the carrier based upon a position of a substrate clamp in the carrier. Numerous other aspects are provided.

Abstract: A batch processing platform used for ALD or CVD processing is configured for high throughput and minimal footprint. In one embodiment, the processing platform comprises an atmospheric transfer region, at least one batch processing chamber with a buffer chamber and staging platform, and a transfer robot disposed in the transfer region wherein the transfer robot has at least one substrate transfer arm that comprises multiple substrate handling blades. The platform may include two batch processing chambers configured with a service aisle disposed therebetween to provide necessary service access to the transfer robot and the deposition stations. In another embodiment, the processing platform comprises at least one batch processing chamber, a substrate transfer robot that is adapted to transfer substrates between a FOUP and a processing cassette, and a cassette transfer region containing a cassette handler robot. The cassette handler robot may be a linear actuator or a rotary table.

Abstract: The invention provides methods, systems and apparatus for opening a substrate carrier. The invention provides a novel loadport for receiving a substrate carrier from a substrate carrier transport system. The loadport includes a door opening mechanism adapted use vacuum pressure to hold a substrate carrier door against the door opening mechanism. The loadport is further adapted to apply a gas flow to the periphery of the substrate carrier to block potential contaminants from entering the substrate carrier. Numerous other features are provided.

Abstract: Embodiments of the present invention are directed to substrate processing systems having substrate transferring mechanisms that are compact, have small footprints, and provide fast and efficient substrate transfer to achieve high throughput. In specific embodiments, a unit slab construction is used for the chambers around the substrate transferring mechanism, enabling efficient system construction with improved alignment and at a lower cost. The chambers may share gas, pump, and other utilizes. In one embodiment, an apparatus for processing substrates includes at least three robot blades each configured to support a substrate. A robot is coupled with the at least three robot blades to simultaneously move the robot blades between at least three chambers and simultaneously transfer each of the substrates supported on the robot blades from one chamber to another chamber.

Abstract: A wafer handler having a central body with a first end and a central axis of rotation is provided. A first end effector, adapted to support a first wafer, is rotatably coupled to the first end of the central body so as to define a first axis of rotation between the central body and the first end effector. Optionally, a second end effector adapted to support a second wafer is rotatably coupled to the second end of the central body so as to define a second axis of rotation between the central body and the second end effector. When the central body is rotated about the central axis of rotation in a first direction over a first angular distance, the first end effector simultaneously rotates about the first axis of rotation and the optional second end effector rotates about the second axis of rotation. Both end effectors are rotated over a second angular distance that is greater than the first angular distance. One or more of the end effectors may be pocketless.