Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.

Abstract: A circuit board has a first component interface configured to connect to a first circuit board component, a second component interface configured to connect to a second circuit board component, a differential signal pair electrically connecting the first component interface to the second component interface, and a signal return path configured to operate as a signal return pathway for the differential signal pair. The signal return path includes first conductive material which is in electrical communication with the first component interface, second conductive material which is in electrical communication with the second component interface, and a dielectric which provides direct current separation between the first and second conductive material. Such a circuit board may alleviate the need for DC blocking capacitors along the differential pair, and along other differential pairs when the circuit board has multiple differential pairs connecting the first and second component interfaces.

Abstract: A circuit board has a first component interface configured to connect to a first circuit board component, a second component interface configured to connect to a second circuit board component, a differential signal pair electrically connecting the first component interface to the second component interface, and a signal return path configured to operate as a signal return pathway for the differential signal pair. The signal return path includes first conductive material which is in electrical communication with the first component interface, second conductive material which is in electrical communication with the second component interface, and a dielectric which provides direct current separation between the first and second conductive material. Such a circuit board may alleviate the need for DC blocking capacitors along the differential pair, and along other differential pairs when the circuit board has multiple differential pairs connecting the first and second component interfaces.

Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.

Abstract: A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.