Patents by Inventor Vinayak P. Risbud

Vinayak P. Risbud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9990016
    Abstract: In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: June 5, 2018
    Assignee: Intel Corporation
    Inventors: Thanunathan Rangarajan, Vinayak P. Risbud, Tabassum Yasmin
  • Publication number: 20170351308
    Abstract: In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 7, 2017
    Inventors: Thanunathan Rangarajan, Vinayak P. Risbud, Tabassum Yasmin
  • Patent number: 9760136
    Abstract: In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: September 12, 2017
    Assignee: Intel Corporation
    Inventors: Thanunathan Rangarajan, Vinayak P. Risbud, Tabassum Yasmin
  • Publication number: 20160048347
    Abstract: In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 18, 2016
    Inventors: Thanunathan Rangarajan, Vinayak P. Risbud, Tabassum Yasmin