Patents by Inventor Vinayak Reddy Panavala

Vinayak Reddy Panavala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged device adapter with parameter indication
    Patent number: 9835650
    Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: December 5, 2017
    Assignee: IRONWOOD ELECTRONICS, INC.
    Inventors: Ilavarasan M. Palaniappa, Mickiel P. Fedde, Vinayak Reddy Panavala, Sultan M. Faiz, Scott Delano
  • Packaged device adapter with force applied using bearing apparatus
    Patent number: 9812795
    Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: November 7, 2017
    Assignee: IRONWOOD ELECTRONICS, INC.
    Inventors: Ilavarasan M. Palaniappa, Mickiel P. Fedde, Vinayak Reddy Panavala, Jacob Ray Vavra
  • PACKAGED DEVICE ADAPTER WITH FORCE APPLIED USING BEARING APPARATUS
    Publication number: 20170125922
    Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.
    Type: Application
    Filed: November 3, 2015
    Publication date: May 4, 2017
    Inventors: ILAVARASAN M. PALANIAPPA, MICKIEL P. FEDDE, VINAYAK REDDY PANAVALA, JACOB RAY VAVRA
  • PACKAGED DEVICE ADAPTER WITH PARAMETER INDICATION
    Publication number: 20150355234
    Abstract: An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a socket lid assembly configured to apply a force upon a packaged device received in the socket cavity of the adapter body. A measurement apparatus associated with the socket lid assembly may include a measurement element (e.g., temperature sensing element, compressible element, etc.) that is configured to contact a packaged device received in the socket cavity when the socket lid assembly closes the socket cavity and applies a force upon the packaged device (e.g., a measurement signal is generated with use of the measurement element that is configured to contact the packaged device). An indicator may be configured to display a parameter based on the measurement signal (e.g., a count, a temperature, etc.).
    Type: Application
    Filed: June 10, 2014
    Publication date: December 10, 2015
    Applicant: IRONWOOD ELECTRONICS, INC.
    Inventors: Ilavarasan M. Palaniappa, Mickiel P. Fedde, Vinayak Reddy Panavala, Sultan M. Faiz, Scott Delano
  • Adapter apparatus with deflectable element socket contacts
    Patent number: 9048565
    Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: June 2, 2015
    Assignee: Ironwood Electronics, Inc.
    Inventors: Ilavarasan M. Palaniappa, Vinayak Reddy Panavala, Mickiel P. Fedde
  • ADAPTER APPARATUS WITH DEFLECTABLE ELEMENT SOCKET CONTACTS
    Publication number: 20140370725
    Abstract: An adapter apparatus includes a substrate having a plurality of openings defined therethrough. Further, a deflectable element socket contact is provided in each of the openings. When a conductive male pin is positioned in contact between first and second deflectable elements of the deflectable element socket contact, at least a portion of the first and second deflectable elements are caused to deflect within first and second deflection regions, respectively, of the defined opening.
    Type: Application
    Filed: June 12, 2013
    Publication date: December 18, 2014
    Inventors: Ilavarasan M. Palaniappa, Vinayak Reddy Panavala, Mickiel P. Fedde