Abstract: Deformation of a substrate due to one or more processing steps is determined by measuring substrate alignment data at lithographic processing steps before and after the one or more processing steps. Any abnormal pattern in the alignment data differential is identified by comparing the calculated alignment data differential with previous data accumulated in a database. By comparing the abnormal pattern with previously identified tool-specific patterns for alignment data differential, a processing step that introduces the abnormal pattern and/or the nature of the abnormal processing can be identified, and appropriate process control measures can be taken to rectify any anomaly in the identified processing step.

Abstract: A plurality of reticles for printing structures in the same lithography level includes an alignment structure pattern within a same relative location in each reticle. Each set of process segmentations in a grating has a reticle segmentation pitch, which is common across all gratings in the plurality of reticles. Within each pair of alignment structure patterns that occupy the same relative location in any two of the plurality of reticles, the process segmentations in one reticle are shifted relative to the process segmentations in the other reticle by a fraction of a reticle segmentation pitch. After printing all patterns in the plurality of reticles, a composite printed process segmentation structure on the substrate includes printed segmentation structures that are spaced by 1/n times the printed segmentation pitch. The pattern for the next level can be aligned to the composite printed process segmentation structure in a single alignment operation.

Abstract: A plurality of reticles for printing structures in the same lithography level includes an alignment structure pattern within a same relative location in each reticle. Each set of process segmentations in a grating has a reticle segmentation pitch, which is common across all gratings in the plurality of reticles. Within each pair of alignment structure patterns that occupy the same relative location in any two of the plurality of reticles, the process segmentations in one reticle are shifted relative to the process segmentations in the other reticle by a fraction of a reticle segmentation pitch. After printing all patterns in the plurality of reticles, a composite printed process segmentation structure on the substrate includes printed segmentation structures that are spaced by 1/n times the printed segmentation pitch. The pattern for the next level can be aligned to the composite printed process segmentation structure in a single alignment operation.

Abstract: Deformation of a substrate due to one or more processing steps is determined by measuring substrate alignment data at lithographic processing steps before and after the one or more processing steps. Any abnormal pattern in the alignment data differential is identified by comparing the calculated alignment data differential with previous data accumulated in a database. By comparing the abnormal pattern with previously identified tool-specific patterns for alignment data differential, a processing step that introduces the abnormal pattern and/or the nature of the abnormal processing can be identified, and appropriate process control measures can be taken to rectify any anomaly in the identified processing step.

Abstract: A plurality of reticles for printing structures in the same lithography level includes an alignment structure pattern within a same relative location in each reticle. Each set of process segmentations in a grating has a reticle segmentation pitch, which is common across all gratings in the plurality of reticles. Within each pair of alignment structure patterns that occupy the same relative location in any two of the plurality of reticles, the process segmentations in one reticle are shifted relative to the process segmentations in the other reticle by a fraction of a reticle segmentation pitch. After printing all patterns in the plurality of reticles, a composite printed process segmentation structure on the substrate includes printed segmentation structures that are spaced by 1/n times the printed segmentation pitch. The pattern for the next level can be aligned to the composite printed process segmentation structure in a single alignment operation.

Abstract: Disclosed is a sorbent device that includes a and sorbent assembly containing a plurality of layered sorbent plates. Each sorbent plate has opposing sorbent surfaces formed of a layer of a sorbent material affixed to each side of a planar support sheet. The sorbent plates are layered so that each of the opposing sorbent surfaces is adjacent to one of the opposing sorbent surfaces on another of the sorbent plates and spaced apart from one another to form a channel between each pair of adjacent opposing sorbent surfaces. An inlet valve provides fluid communication between the sorbent assembly and a gas source, while a two-way outlet valve fluid communication between the sorbent assembly and a processor or a vacuum pump.

Abstract: The present invention provides a method of treating silica, wherein dry silica is contacted with a reaction medium consisting essentially of concentrated aqueous acid and a hydrophobing agent selected from the group consisting of organosiloxanes and organochlorosilanes. The silica is then reacted with the hydrophobing agent in the reaction medium for about 90 minutes or less at a temperature from about 10° C. to about 40° C. to provide a hydrophobic treated silica. The hydrophobic treated silica then is recovered.

Abstract: The present invention provides a method of preparing lipophilic silica in an aqueous medium in the absence of added acids, bases, or organic solvents. In particular, the present inventive method of preparing lipophilic silica comprises (a) providing a mixture consisting essentially of (i) at least one organically modified silica precursor which is a trifunctional silane, (ii) water, and (iii) at least one tetrafunctional silane, (b) allowing the organically modified silica to form in the mixture, and (c) removing the organically modified silica from the mixture.

Abstract: The present invention provides a method of treating silica wherein silica is reacted with a di- or tri-functional organosilane in an aqueous acid medium to provide a crude organosilane-capped silica product containing organosilicon impurities. The organosilicon impurities are extracted from the crude product with an organic liquid to provide a purified product consisting essentially of organosilane-capped silica. The purified product is dried to provide a dry organosilane-capped silica. The aqueous acid medium can include a displacing reagent which displaces at least one reactive functional group of the di- or tri-functional organosilane. The present invention further provides-continuous methods of treating silica with di- and tri-functional organosilanes, wherein the organic liquid and/or the organosilicon impurities are recycled and reused.

Abstract: A method of preparing treated silica is described. The method comprises mixing a hydrolyzable silica precursor such as methyltrichlorosilane with water, an acid (e.g., hydrochloric acid) and a hydrophobing agent capable of rendering polar silanol groups hydrophobic, such as trimethylchlorosilane. The treated silica is then recovered from the mixture.The inventive method provides a number of mechanisms for controlling the physical properties (e.g., particle size, surface area, etc.) of the treated silica. For example, the rate of hydrolysis of the silica precursor, which impacts these physical properties, can be regulated by the nature and concentration of the acid used in the reaction.