Patents by Inventor Vince Biviano

Vince Biviano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
    Patent number: 9004366
    Abstract: Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: April 14, 2015
    Assignee: Thin Film Electronics ASA
    Inventors: Patrick Smith, Criswell Choi, Vikram Pavate, James Montague Cleeves, Vivek Subramanian, Richard Young, Vince Biviano
  • Wireless Devices Including Printed Integrated Circuitry and Methods for Manufacturing and Using the Same
    Publication number: 20090095818
    Abstract: Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor.
    Type: Application
    Filed: October 10, 2008
    Publication date: April 16, 2009
    Inventors: Patrick Smith, Criswell Choi, Vikram Pavate, James Montague Cleeves, Vivek Subramanian, Richard Young, Vince Biviano