Patents by Inventor Vince P. Hileman

Vince P. Hileman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6783325
    Abstract: The disclosed system is directed towards a tray bracket. The tray bracket comprises a tray bracket inlet, the tray bracket inlet has tray bracket inlet coupling elements. A tray bracket outlet is coupled to the tray bracket inlet and the tray bracket outlet has a body. The tray bracket includes a plurality of tray bracket outlet passages contiguous with the body. The plurality of tray bracket outlet passages are aligned with fan passages of at least one fan unit. The tray bracket outlet passages and the fan passages provide low impedance to air flow and low noise. The tray bracket includes attaching mechanisms contiguous with the body. The attaching mechanisms are manually demountably coupled to the tray bracket inlet coupling elements.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: August 31, 2004
    Assignee: Sun Microsystems, Inc.
    Inventors: Vince P. Hileman, Robert J. Lajara, Thomas E. Stewart
  • Patent number: 6215666
    Abstract: A giga-bit interface convertor module bracket assembly having upper and lower ground springs. The upper ground spring has upper wing-shaped springs in the upper part of the front opening of the bracket assembly and a pair of upper spring tabs on the interior of the bracket assembly. The lower ground spring has lower wing-shaped springs in the lower part of the front opening of the bracket assembly and a pair of lower spring tabs on the interior of the bracket assembly. When a giga-bit interface convertor module is inserted in the bracket assembly through the front opening, the upper and lower spring tabs bias against the top and bottom walls of the giga-bit interface convertor module to provide grounding thereto. Additionally, the upper and lower wing-shaped springs contact with a front panel of an enclosure or bracket or an electronic card on which the bracket assembly sits. The lower ground spring is provided with a bottom ground spring to contact the electronic card for grounding.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: April 10, 2001
    Assignee: Sun Microsystems, Inc.
    Inventors: Vince P. Hileman, Cornelius B. O'Sullivan
  • Patent number: 6144553
    Abstract: A refrigeration system for a disk drive storage is provided. The refrigeration system employs pairs of thin conducting plates, each pair of which is placed so as to sandwich a disk drive. The refrigeration system conducts heat generated from the disk drives via the thin conducting plates, heat pipes coupled to the thin conducting plates, a back plate and a chilled manifold. The heat is further removed as a refrigerant travels through to a compressor and then to a condenser, both of which are connected to the chilled manifold. In this way, the disk drive storage is able to increase its capacity from a bank of twelve disk drives to fourteen disk drives for a 1 inch disk drive storage and from eight disk drives to nine disk drives for a 1.6 inch disk drive storage system, thereby realizing an increased density system without sacrificing a low operating temperature.
    Type: Grant
    Filed: September 9, 1998
    Date of Patent: November 7, 2000
    Assignee: Sun Microsystems, Inc.
    Inventors: Vince P. Hileman, Gary A. Harpell
  • Patent number: 6052285
    Abstract: An electronic assembly that includes a heat pipe that extends from an electronic card. The heat pipe has a condenser end that can be inserted into an elastic thermally conductive port of a manifold. The manifold may be part of a cooling system that removes heat from the condenser end of the heat pipe. The port may include a metal filled elastomeric material. The elastic characteristic of the material may accommodate for tolerances in the system and insure contact between the material and the heat pipe. The metal filler provides a thermal path from the heat pipe to the manifold. The elastic port allows the heat pipe to be coupled to the manifold without any fasteners.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: April 18, 2000
    Assignee: Sun Microsystems, Inc.
    Inventor: Vince P. Hileman
  • Patent number: 5999404
    Abstract: An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to the modules. The cooling fluid can flow directly onto integrated circuits or integrated circuit packages located within the modules. Each module may have an electrical connector and a fluid connector that allows the sub-module to be plugged into the module, and the module to be plugged into the motherboard and manifold without using any tools or hardware.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: December 7, 1999
    Assignee: Sun Microsystems, Inc.
    Inventor: Vince P. Hileman