Patents by Inventor Vincent A. Spadafora

Vincent A. Spadafora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a microcircuit substrate
    Patent number: 4572757
    Abstract: Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces on the substrate during lead bonding.
    Type: Grant
    Filed: January 23, 1984
    Date of Patent: February 25, 1986
    Assignee: The Jade Corporation
    Inventor: Vincent A. Spadafora