Abstract: The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.

Abstract: The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.

Abstract: The present disclosure provides a portable photovoltaic unit and a photovoltaic system. The system comprises a plurality of interconnectable photovoltaic module units each unit comprising a photovoltaic device. The units are arranged for releasably coupling to each other so that an electrical interconnection between the units is established and energy can be accessed from electrical contacts that are disposed on the same side of one of the units.

Abstract: The present disclosure provides a method for forming a contact for a photovoltaic device and a photovoltaic device manufactured according to the method. The method comprises the steps of: depositing a polymeric layer onto a surface of the photovoltaic device; exposing a region of the polymeric layer to laser light; developing the polymeric layer to create at least one opening in the polymeric layer for accessing a respective portion of the surface; depositing a conductive material into the at least one opening of the polymeric layer in a manner such that the conductive material is in electrical contact with the respective portion of the surface; and removing at least a portion of the remaining developed polymeric layer from the surface.